Tuesday, September 23, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Future Of Apple's Beats Music Remains Uncertain
Facebook to Announce New Advertising Platform : report
New Toshiba Tecra C50 Laptop Delivers Security at Affordable Price
PlayStation TV Coming October 14th
Samsung Galaxy Alpha And LG G3 Vigor Coming from AT&T
EMC In Merger Talks With Other Companies: reports
HTC To Make Next Google Nexus tablet: report
MediaTek Unveils LinkIt Platform to Support Wearable and IoT Device Creation
Active Discussions
How to evaluate the quality of the Free Driver Updater
Hi everybody
i am a new here.
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
 Home > News > General Computing > Intel, ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, November 24, 2008
Intel, Micron Move into Mass Production with 34nm NAND Flash


Intel and Micron today announced mass production of their jointly developed 34nm, 32 gigabit multi-level cell (MLC) NAND flash memory device.

Developed and manufactured by the companies? NAND flash joint venture, IM Flash Technologies (IMFT), the process technology is the most advanced process available on the market and enables the industry?s only monolithic 32 Gb NAND chip that fits into a standard 48-lead thin small-outline package (TSOP). The companies are ahead of schedule with 34nm NAND production, expecting their Lehi facility to have transitioned more than 50 percent of its capacity to 34nm by year?s end.

The 34nm, 32 Gb chips are manufactured on 300 mm wafers. Measuring just 172mm², less than the size of a thumbnail, the 34nm, 32 Gb chip will enable high-density solid-state storage in small form factor applications including digital cameras, personal music players and digital camcorders. Additionally, the chip will enable more cost-effective solid-state drives, increasing their current storage capacity.

The companies also plan to begin sampling lower density multi-level cell (MLC) and single-level cell (SLC) products using the 34nm process technology in early 2009.


Previous
Next
Spamer to Pay facebook $873.3 Million        All News        Plextor Announces New Lineup of Optical Drives with PlexUTILITIES Diagnostic Software
Spamer to Pay facebook $873.3 Million     General Computing News      Korean Scientists Claim Breakthrough in OLED screen Technology

Get RSS feed Easy Print E-Mail this Message

Related News
Latest Intel LTE Chipset Certified on China Mobile
Micron M600 SSD Released With Dynamic SLC Cache
Intel Offers Developers Software Tools, Outlines PC Evolution Across New Form Factors
Intel Unveils New Developer Tools, Future Technologies Tablets, Analytics, Wearable Devices and PCs at IDF 2014
New Intel Xeon E5-2600 v3 Processors Released
Intel Turns To Fashionable Wearables With Collaboration With Fossil Group
New Intel Core M Processor Coming In Tablets, Hybrids
Latest Intel Graphics Driver Update Boosts Performance
Opening Ceremony and Intel Reveal MICA Accessory
Intel Hopes To Improve Its Mobile Business With Ex-Qualcomm exec
Intel Unleashes its First 8-Core Desktop Processor For Gaming
Intel Introduces World's Smallest Standalone 3G Modem

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .