Sunday, February 14, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Researchers Download "Game Of Thrones" In Just 1 Second!
Apple: Dr. Dre Starring In New TV Series; New iPhone, iPad Coming in March
Foxconn Seeks For Partner To Boost Bid For Sharp
Micron Outlines Tts First 3D NAND Products
AT&T To Start 5G Trials This Year
Uber Agrees to Settle Safety Lawsuits
Google To Expand Right-to-Be-Forgotten Removals Following Pressure From Europe
Apple And At&T Sued For Infringement of Touch Feedback Patents
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
 Home > News > General Computing > Canon t...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, July 07, 2011
Canon to Launch its First Back-end Semiconductor Manufacturing Tool


Canon is entering the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV, a tool for next-generation semiconductor packaging.

As smart phones, tablet PCs and other electronic devices become progressively smaller and more intelligent, the demand for integration and shrinkage on semiconductor devices continues to increase. One way to realize such integration is to employ a three-dimensional layout of chips, layering multiple semiconductor chips vertically and interconnecting the chips to configure a single device. To facilitate this interconnection, the industry has developed Through Silicon Via (TSV) and Bump processes, enabling multifold increases of memory capacity, high-speed data transfer, and reduced electricity consumption in a smaller layout area.

The launch of the new Canon FPA-5510iV semiconductor lithography tool accommodates the industry's TSV and Bump process needs. The tool, which utilizes the technology cultivated through the company's FPA-5500iZ front-end tool series, marks Canon's first-ever back-end lithography step.

Because the resist film used in the TSV and Bump processes is relatively thick, the FPA-5510iV is equipped with an optimized Numerical Aperture for the thickness with a pattern size of one to several tens of microns, and realizes small and deep vertical holes in the thick resist. The Numerical Aperture is adjustable to handle various patterns, controlling the image depth of focus, resolution and resist profile.

The FPA-5510iV also features a large exposure area and high-intensity light exposure to deliver high productivity performance. The system's projection lens optics expose an area measuring 52 x 34 mm, compared with the 26 x 33 mm area exposed by front-end tools, and the illumination optics utilize a 4.5kW high-intensity lamp as the light source.

The FPA-5510iV goes on sale today.


Previous
Next
Toshiba Launches Highly Sensitive CMOS Image Sensor For smartphones        All News        Toshiba, Showa Denko and TDK Join Forces On HDD Technology
Apple's iOS Flaw Exposed     General Computing News      Facebook Implements Skype Video Chat, New Group Chat Features

Get RSS feed Easy Print E-Mail this Message

Related News
Canon's Latest EOS-1D X Mark II Digital Camera Goes 4K
Canon Releases The 20MP PowerShot SX540 and SX420 Cameras
Canon Showcases 8K Camera, 360-degree 3D videos And 4K Projectors At Canon EXPO
Canon and Fujitsu To Work On Network Cameras
Canon Debuts EOS M10, GX 5 and GX 9 Cameras
Canon Develops Material Appearance Image-processing Technology, Next-generation Imaging Devices
Canon Develops 250-megapixel APS-H-size CMOS Sensor
New Camera-Lens Optical Element Enables Extremely High Levels of Chromatic Aberration Correction
Canon Cuts Outlook Following Weak Camera Sales
Canon Powershot G3 X Camera Released
New Canon Compact Binoculars Feature Improved Image Stabilization and Low Power Consumption
Canon Develops New Video Format For 4K Camcorders

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .