Wednesday, July 23, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
European Regulators May Need Extra Concessions From Google
Apple Granted Patent for Smartwatch
New Intel Solid-State Drive Pro 2500 Series Packs SK Hynix Flash And Brings Trusted Security Features
Alliance Storage Technologies Releases Enterprise Class Cloud-Integrated Storage Solution
NVIDIA Launches Shield Tablet For Gamers
AOC u3477Pqu 34-Inch WQHD Monitor Announced
ADATA Launches XPG V3 DDR3 Memory For Overclockers
Licensing Fees Drive ARM's Profit
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > General Computing > Canon t...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, July 07, 2011
Canon to Launch its First Back-end Semiconductor Manufacturing Tool


Canon is entering the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV, a tool for next-generation semiconductor packaging.

As smart phones, tablet PCs and other electronic devices become progressively smaller and more intelligent, the demand for integration and shrinkage on semiconductor devices continues to increase. One way to realize such integration is to employ a three-dimensional layout of chips, layering multiple semiconductor chips vertically and interconnecting the chips to configure a single device. To facilitate this interconnection, the industry has developed Through Silicon Via (TSV) and Bump processes, enabling multifold increases of memory capacity, high-speed data transfer, and reduced electricity consumption in a smaller layout area.

The launch of the new Canon FPA-5510iV semiconductor lithography tool accommodates the industry's TSV and Bump process needs. The tool, which utilizes the technology cultivated through the company's FPA-5500iZ front-end tool series, marks Canon's first-ever back-end lithography step.

Because the resist film used in the TSV and Bump processes is relatively thick, the FPA-5510iV is equipped with an optimized Numerical Aperture for the thickness with a pattern size of one to several tens of microns, and realizes small and deep vertical holes in the thick resist. The Numerical Aperture is adjustable to handle various patterns, controlling the image depth of focus, resolution and resist profile.

The FPA-5510iV also features a large exposure area and high-intensity light exposure to deliver high productivity performance. The system's projection lens optics expose an area measuring 52 x 34 mm, compared with the 26 x 33 mm area exposed by front-end tools, and the illumination optics utilize a 4.5kW high-intensity lamp as the light source.

The FPA-5510iV goes on sale today.


Previous
Next
Toshiba Launches Highly Sensitive CMOS Image Sensor For smartphones        All News        Toshiba, Showa Denko and TDK Join Forces On HDD Technology
Apple's iOS Flaw Exposed     General Computing News      Facebook Implements Skype Video Chat, New Group Chat Features

Get RSS feed Easy Print E-Mail this Message

Related News
Canon Launches Photo Saving Cloud Platform
Canon Releases Two New EF Ultra Wide-Angle Zoom Lenses and White EOS Rebel SL1 Digital SLR Camera
Canonical to Close Ubuntu One File Services
Canon Unveils New Cameras
Canon Expands Line of Vixia Camcorders, PowerShot Cameras
Canon Introduces The DP-V3010 4K Reference Display
Canonical Introduces Ubuntu 13.10 For Both Desktop And Mobile
New Canon PowerShot Models Provide Powerful Optics, Fast Autofocusing
Canonical Launches Ubuntu Edge Superphone - PC Combination Campaign
Ubuntu Forums Hacked, 1.82M Logins, Email Addresses Stolen
Canon Introduces The New EOS 70D Digital SLR Camera With Dual Pixel CMOS AF Technology
Canon Announces New PowerShot SX280 HS, EOS Rebel SL1 And T5i Models

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .