Monday, September 15, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Panasonic Showcases Optimized Workflow at IBC 2014
DVB Demonstrates New Platforms To Deliver UHD and HD Services
JPMorgan Servers Hacked in June
G-Technology RReleases New External Hard Drives New 64TB G-SPEED Studio XL
Apple Enjoys Huge Demand For New iPhone 6 Plus
Ultra High Definition Logo Launched
Sony Unveils New PXW-FS7 Compact 4K XDCAM Camera, PXW-X200 XDCAM Camcorder And Professional Memory Cards
Sharp Pushes Back Production Of Energy-efficient MEMS-IGZO Displays
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > Mobiles > Docomo,...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 13, 2011
Docomo, Samsung to Join Forces in Mobile Phone Chips


NTT Docomo Inc. and Samsung Electronics Co. are reportedly considering joining forces along with several other Japanese handset manufacturers to develop semiconductors for mobile phones on a new-generation mobile broadband standard, sources close to the matter said Tuesday, according to a Nikkei business daily report.

The two companies along with Fujitsu Ltd., NEC Corp. and Panasonic Mobile Communications Co. are planning to set up a jointly owned unit in Japan to design and develop a chip for regulating wireless signals to be mounted on handsets for the LTE standard, in an attempt to challenge the dominance of Qualcomm, the major supplier of a similar chip for the current 3G wireless mobile communications service.

DoCoMo is to take a majority stake in the joint venture, to be capitalized at about 30 billion yen ($389.6 million) and headquartered in Japan, said the paper.

Samsung expects the joint venture to help it in the development of next-generation telecommunication while DoCoMo hopes to lower chip procurement costs by taking part in development, the daily reported.


Previous
Next
Intel, Samsung and Microsoft Join SanDisk in Support Of New SATA-IO Standard Proposal        All News        Fujitsu Develops Ultra-fast Terahertz-band Imaging Scanning Technology
LG To Introduce Street Fighter IV game On Upcoming HD Smartphones     Mobiles News      AT&T Announces Windows Phone Lineup

Get RSS feed Easy Print E-Mail this Message

Related News
Diesel Black Gold Introduces Custom Samsung Gear S at Runway Show
Samsung Outlines Its Vision for the Future Home At IFA 2014
Samsung Launches Tizen Wearable SDK for Gear S
Samsung Galaxy Tab Active Announced At IFA
Samsung Goes Curvy At IFA 2014
Samsung Partners With Oculus On Gear VR, Announces Galaxy Note 4 And Galaxy Edge at IFA 2014
Samsung Acquires Canadian Cloud Solution Provider
Samsung Introduces First Curved Soundbar For TVs
Samsung Partners with Nike On Running App
Samsung Applied for Samsung Quantum Dot TV Trademark
Samsung, LG Introduce New Smartwatches
Samsung Starts Mass Production Of First 3D TSV DDR4 Modules

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .