Tuesday, September 30, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Gionee Announced The World's Thinnest Smartphone
MPEG LA Rolls Out HEVC License
PayPal To Become An Independent Publicly Traded Company in 2015
AMD To Showcase ARM Cortex-A57-Based Hadoop on Opteron Processors
SanDisk Introduces New X300 SSD And Client SSD Upgrade Service For Corporate Environments
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
Google To Unveil New Music Services
Europe Says Ireland Helped Apple Pay Less Taxes
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > Mobiles > Docomo,...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 13, 2011
Docomo, Samsung to Join Forces in Mobile Phone Chips


NTT Docomo Inc. and Samsung Electronics Co. are reportedly considering joining forces along with several other Japanese handset manufacturers to develop semiconductors for mobile phones on a new-generation mobile broadband standard, sources close to the matter said Tuesday, according to a Nikkei business daily report.

The two companies along with Fujitsu Ltd., NEC Corp. and Panasonic Mobile Communications Co. are planning to set up a jointly owned unit in Japan to design and develop a chip for regulating wireless signals to be mounted on handsets for the LTE standard, in an attempt to challenge the dominance of Qualcomm, the major supplier of a similar chip for the current 3G wireless mobile communications service.

DoCoMo is to take a majority stake in the joint venture, to be capitalized at about 30 billion yen ($389.6 million) and headquartered in Japan, said the paper.

Samsung expects the joint venture to help it in the development of next-generation telecommunication while DoCoMo hopes to lower chip procurement costs by taking part in development, the daily reported.


Previous
Next
Intel, Samsung and Microsoft Join SanDisk in Support Of New SATA-IO Standard Proposal        All News        Fujitsu Develops Ultra-fast Terahertz-band Imaging Scanning Technology
LG To Introduce Street Fighter IV game On Upcoming HD Smartphones     Mobiles News      AT&T Announces Windows Phone Lineup

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Starts Producing 3.2-Terabyte NVMe SSD Based on 3D V-NAND for Severs
Samsung Shrinks Its PC business
Samsung Launches Note 4 , Gear S Coming This Fall
Samsung Galaxy Alpha And LG G3 Vigor Coming from AT&T
Order Your Samsung Galaxy Note 4 Today
Samsung Now Mass Producing 20-Nanometer 6Gb LPDDR3 Mobile DRAM
New Samsung NX1 Launches With APS-C backside-illuminated CMOS
Korean Authorities To Inverstigate LG-Samsung Dispute
Samsung Open Source Conference Kicks off Tuesday
Diesel Black Gold Introduces Custom Samsung Gear S at Runway Show
Samsung Outlines Its Vision for the Future Home At IFA 2014
Samsung Launches Tizen Wearable SDK for Gear S

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .