TSMC today announced that its 28nm process is in volume production and production wafers have been shipped to the company's customers.

TSMC's 28nm process offering includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM). Among these technology offerings, 28HP, 28HPL and 28LP are all in volume production and 28HPM will be ready for production by the end of this year, according to the company. TSMC has already distributed the production-version design collateral of 28HPM to its mobile computing customers for their product-design use.

TSMC added that the number of its customer 28nm production tape outs has more than doubled as compared with that of 40nm. At 28nm, there are currently more than 80 customer product tape-outs. In addition, the company claims that its 28nm process has surpassed the previous generation's production ramps and product yield at the same point in time, due to closer and earlier collaboration with its customers.

Altera, AMD, NVIDIA, Qualcomm and Xilinx are among TSMC's clients.

"Being the first to 28nm volume production demonstrates TSMC's leadership in technology and brings great value to our customers through design wins with competitive products," said Jason Chen, TSMC Senior Vice President, Worldwide Sales and Marketing.