Thursday, May 28, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Avago To Buy Broadcom: report
FCC Moves To Protect Consumers From Robocalls
Software Bug Causes iPhone Crashes
Google Cardboard VR Gadget And New Android Version Among I/O Highlights
WD Upgrades My Passport Drives Series
Xiaomi Starts Offering Accessories In Europe
Nokia Networks to Acquire Eden Rock
Sony Aims At Growth Phase on Games, Image Sensors
Active Discussions
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Altera ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, March 22, 2012
Altera and TSMC Develop Heterogeneous 3D IC Test Vehicle Using CoWoS Process


Altera and TSMC today announced the joint development of the first heterogeneous 3D IC test vehicle using TSMC?s Chip-on-Wafer-on-Substrate (CoWoS) integration process.

Heterogeneous 3D ICs are one of the innovations enabling the industry's move beyond Moore's Law by stacking various technologies within a single device, including analog, logic and memory. TSMC's integrated CoWoS process provides semiconductor companies developing 3D ICs an end-to-end solution that includes the front-end manufacturing process as well as back-end assembly and test solutions.

Altera is the first semiconductor company to develop and complete characterization of a heterogeneous test vehicle using TSMC's CoWoS process. This and additional test vehicles enable Altera to quickly test the capabilities and reliability of 3D ICs to ensure they meet yield and performance targets.

Altera's vision for heterogeneous 3D ICs includes developing device derivatives that allow customers to mix and match silicon IP based on their application requirements. Altera will leverage its position in FPGA technology and integrate various technologies with an FPGA, including CPUs, ASICs, ASSPs, memory and optics.

"Our partnerships with standards bodies like IMEC and SEMATECH, and our use of TSMC's leading-edge CoWoS manufacturing and assembly process put us in an excellent position to execute on our strategy of delivering heterogeneous 3D devices to our customers at the right time and with the right set of features," said Bill Hata, senior vice president of worldwide operations and engineering at Altera. "Implementing heterogeneous 3D capabilities into our devices enables us to continue our path of technology innovation and leadership, and carry us beyond Moore?s Law."

CoWoS is an integrated process technology that attaches device silicon chips to a wafer through a chip on wafer (CoW) bonding process. The CoW chip is attached to the substrate (CoW-On-Substrate) to form the final component. By attaching the device silicon to the original thick wafer silicon before it finishes the fabrication process, manufacturing-induced warping is avoided. TSMC plans to offer CoWoS as a turnkey manufacturing service.


Previous
Next
Super Talent Releases New RAIDDrive upStream PCI3 SSD        All News        Nvidia Releases New GeForce GTX 680 GPU
Facebook Buys IBM Patents To Build Legal Defenses     General Computing News      New Facebook Tool Helps Users Filter Their Friend's Feeds

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Resumes Take Over Talks With Altera: Paper
TSMC Solar Commercial-size Modules Achieve Record Efficiency
TSMC Start 10nm Manufacturing in mid-2016
TSMC Reports 65 pct Rise in Q1 Profit
Takeover Talks Between Altera and Intel Failed: report
Intel in Talks to buy Altera: report
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .