Monday, September 26, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Snapchat Introduces 'Spectacles' Camera-equipped Glasses, Changes Company name To Snap
Nvidia GPUs Could Return To Apple Macs
Lenovo Brings Fingerprint Authenticated Payments To Laptops
Report Cites Google, Salesforce Interest For Twitter
Dalian Wanda and Sony Enters Team Up in China Movie Business
Apple Develops Amazon Echo-Style Device
ALD Technology Chosen By Samsung, LG For Flexible OLEDs
TSMC To Use Different Processes And 3D Packages Across Future Design Platforms
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > ARM, HP...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 27, 2012
ARM, HP and SK hynix To Participate On The Development Of Memory Cube


ARM, HP, and SK hynix, Inc. have joined the global effort to accelerate widespread industry adoption of Hybrid Memory Cube (HMC) technology.

The companies have joined the Hybrid Memory Cube Consortium (HMCC). Led by Micron and Samsung, the HMCC is a collaboration of original equipment manufacturers (OEMs), enablers and integrators who are cooperating to develop and implement an open interface standard for the new memory technology.

Micron and Samsung are working closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and now ARM, HP and SK hynix ? to draft an industry-wide specification that should pave the way for a wide range of electronic advances.

"The strong collection of companies who have joined the consortium ? representing a broad range of technology interests ? reflects the perceived high value of HMC as the next standard for high-performance memory applications," said Robert Feurle, Micron's vice president for DRAM marketing. "With the addition of ARM, HP and SK hynix as developers, who will help to determine the specific features, the consortium is well positioned to provide a new open standard for next-gen electronics."

HMC features will enable highly efficient memory solutions for applications ranging from industrial products to high-performance computing and large-scale networking. The HMCC's team of developers plans to deliver a draft interface specification to the growing number of "adopters" joining the consortium. Then, the combined team of developers and adopters will refine the draft and release a final interface specification, currently targeted for the end of this year.

As envisioned, HMC capabilities will leap beyond current and near-term memory architectures in the areas of performance, packaging and power efficiencies, offering a major alternative to present memory technology.

One of the primary challenges facing the industry -- and a key motivation for forming the HMCC -- is that the memory bandwidth required by high-performance computers and next-generation networking equipment has increased beyond what conventional memory architectures can provide. The term "memory wall" has been used to describe this challenge. Breaking through the memory wall requires architecture such as HMC that can provide increased density and bandwidth with significantly lower power consumption.


Previous
Next
VESA Brings DisplayPort To Mobiles, Battles With MHL        All News        EU court Rejects Microsofty's Antitrust Appeal, Cuts Fine
New Core i3 Ivy Bridge Mobile Processors Released     PC Parts News      Judge Blocks U.S. Sales of Samsung Galaxy Tab 10.1

Get RSS feed Easy Print E-Mail this Message

Related News
Micron Announces QuantX Branding For 3D XPoint Memory, Releases 3D NAND flash for Mobile Devices
Micron Introduces SLC NAND Flash for IoT and Automotive
Micron To Reduce Workforce Following Slow Third Quarter Results
Micron Showcases 3D NAND-based Ballistix TX3 And Crucial MX300 SSDs at Computex
Micron Expands Singapore NAND Fab
Micron Debuts 3D NAND 1100 and 2100 SSDs
Micron Unveils New NVMe PCIe SSDs, New Flash-storage Solutions For Open Source Data Centers
Micron Swings to Loss
Samsung To Start Mass-Producing 18nm DRAM
Micron Outlines Tts First 3D NAND Products
Micron Outlines GDDR5X Plans
768 Gbit Micron 3D NAND Is Faster Than Samsung’s 256Gb V-NAND: ISSCC

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .