Thursday, September 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony To Offer Unity For PlayStation To PlayStation Licensed Developers
Blackberry Introduces Elegant Porsche Design P9983 Smartphone
Club 3D Launches 4K Docking Station
Logitech Gives You Control of Your Smart Home with the New Harmony Living Home Lineup
New iPads And OS X Yosemite Announcements Expected Next Month
Opera Max Data-savings App to be Embedded into MediaTek's LTE SoCs
Nero 2015 Supports Burning via Smartphone, WiFi Streaming
PMC Delivers 16-port SAS and SATA Storage Controllers
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 05, 2012
TSMC To Delay Transition To 450-mm Wafers


Taiwan Semiconductor Manufacturing Co. (TSMC) will start using 450-millimeter wafers to build its processors in 2018, following delays in the development of the new technology.

J.K. Wang, Taiwan Semiconductor Manufacturing Co.?s vice president for operations/300mm fabs, said the company will begin volume production of chips on 450mm silicon wafers in 2018, offering FinFET transistor technology at 10nm node. He noted that TSMC has completed its planning for deploying 450mm wafer production.

The company's vice president for research and development, Burn Lin, pointed out that TSMC will begin volume production of FinFET transistors at 20nm process and is on the track to deploy 16nm FinFET process. In addition to ultraviolet lithography, Lin said that TSMC is also considering multi e-beam lithography technology for its 10nm FinFET process. He pointed out that TSMC will use the legacy immersion lithography technology on its 10nm and 16nm transistors as EUV is still immature. However, transistors smaller than 10nm will use next-generation lithography technology.

Intel, TSMC, Samsung, IBM, and GlobalFoundry have formed an alliance to push for 450mm technology.

Currently, chip makers are using silicon wafers at the 300-mm size to build their processors. Upgrading to the 450-mm level would allow companies to produce more chips from each wafer, as the 450-mm wafers have 2.5 times more surface area.

Industry has been slow to move forward to 450-mm wafer manufacturing, as billions of dollars are needed to invest in building the tools and factories to produce the wafers.


Previous
Next
Singulus Sees Growth Oportunities Despite Slow Economy        All News        Intel To Present 4th Gen "Haswell" Chips at IDF
Lenovo Buys CCE     General Computing News      Windows Server 2012 Released

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC 28HPC Process Enters Volume Production
TSMC Losses Chip Orders From Apple, Qualcomm: reports
TSMC Q2 profit Increased, 20nm Chips Start Shipping
TSMC Reports Strong Q2 Sales
TSMC Aims At 10nm Chip Production By 2016
TSMC Reports Quarterly Profit
TSMC Enjoys Q4 Profit, Getting Ready For More Efficient Chips
Samsung, TSMC, and Micron Top List of IC Capacity Leaders
Apple Works with TSMC for Manufacturing of A8 Chip: report
TSMC Introduces Its 16nm FinFET Technology
Chipmaker TSMC Reports Increased Earnings
Foundries Spending Big on Capital Equipment

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .