Tuesday, April 21, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Unveils New Hotel Booking Site
Tech Lobbying Spendings Explode
Microsoft Outlines Security And Coontrol features Of Office 365
Twitter Adopts New Policy to Block Threats
HP and FireEye Announce Alliance for Incident Response and Threat Services
BlackBerry To Buy WatchDox to Bolster Mobile Content Security
Samsung To Make New Qualcomm Processors: report
ARM Reports Strong Chip Sales For The First Quarter 2015
Active Discussions
Optiarc AD-7260S review
Help make DVDInfoPro better with dvdinfomantis!!!
Question about nero
Copied dvd's say blank in computer only
menu making
cdrw trouble
Need serious help!!!!
burning
 Home > News > PC Parts > TSMC Sa...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, October 31, 2012
TSMC Says Quad Patterning Could Be Needed For 10nm


Quad patterning may be needed for 10nm manufacturing process technology if extreme ultraviolet (EUV) lithography is not ready in 2015, TSMC says.

In an interview with EE Times after a keynote at the ARM TechCon, TSMC's chief technologist Jack Sun said that quad patterning, which involves four passes through a lithography stepper using four different masks, was one of several options TSMC is exploring as it works on path finding for the process.

Multiple patterning means increased wafer costs, although the cost could be offset by the improved transistor density.

Intel is also considering using quadruple patterning for some mask layers, although the company has already invested in ASML Holding NV, Europe's largest semiconductor equipment maker, to drive extreme ultraviolet (EUV) lithography forward.

EUV lithography hasbeen long seen as the inevitable successor to optical immersion lithography.

Intel plans to start production of chips in the process in three years. Intel also expects to use double patterning in some layers of some chips at 14 nm, which are expected before the end of next year.

In his keynote, TSMC's Sun also showed the roadmap for TSMC, which includes starting limited test production of 20nm planar chips by the end of the year and a 16nm FinFET process starting test production late next year. TSMC expects the new 20nm process holds traditional advances of as much as 35 per cent in performance and power capabilities.


Previous
Next
Sharp Forecasts Full-year Loss, Sony Posts Small 2Q Profit        All News        RIM Tests Carrier Compatibility Of Upcoming BlackBerry 10 Smartphones
Data Storage Institute Launches 5mm Hybrid Hard Disk Drive     PC Parts News      VIA ARTiGO A1250 Is Possibly The World's Smallest x86 Quad Core System

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Start 10nm Manufacturing in mid-2016
TSMC Reports 65 pct Rise in Q1 Profit
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .