Friday, September 22, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Facebook to Provide Congress With Ads Linked to Russian Internet Research Agency
Casio Announces Connected Watches For Men's G-SHOCK G-STEEL Line
AMD Said to Make AI Chip for Tesla
Mercedes to Invest $1 Billion in Alabama Electric Vehicle Factory
Your Next Smartphone's GPS Will be Extremely Accurate
Imagination Announces New PowerVR Series9XE and 9XM PowerVR GPUs, PowerVR 2NX NNA Hardware Neural Network Accelerator
Bose QC35 II Headphones are Optimized for the Google Assistant
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 08, 2013
Toshiba Is Sampling First UFS-compliant Embedded NAND Flash Memory Modules


Toshiba has started sample shipments of a 64GB embedded NAND flash memory module, the first equipped with a UFS I/F.

The module is fully compliant with the JEDEC UFS Ver.1.1 standard and is designed for digital consumer products including smartphones and tablet PCs.

The 64GB NAND flash memory chip boasts with ultra-speedy 3.0Gb/s interface. The module is sealed in a small FBGA package, 12x16x1.2mm, and have a signal layout compliant with JEDEC UFS Ver.1.1.

Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba is offering the samples to OC vendors in order to evaluate the UFS I/F and its protocol in host chipsets. UFS I/F has a serial I/F, offreing scalability in the number of lanes and speed.

Toshiba has not yet decided when it will start mass production of the new 64GB UFS module.

Specifications

Interface: JEDEC UFS Version 1.1 standard

Power Supply Voltage:
2.7V to 3.6V (Memory core)
1.70V to 1.95V (Controller core)
1.10V to 1.30V (UFS I/F signals)

Number of lanes: Downstream 1 lane / Upstream 1 lane
I/F Speed: 2.9Gbps/lane
Temperature range: -25 degrees to +85 degrees Celsius
Package: 169Ball 12x16x1.2mm FBGA


Previous
Next
Twitter Now Showing Older Tweets In Search Results        All News        Seagate Set To Release Four-platter 4TB HDD
Spotify Comes To Windows Phone 8     Mobiles News      Blackberry 10 Won't Reach Japan

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Formalizes Chips Sale to Bain Consortium, WD Steps up Legal Action
Toshiba Has Chosen Japan-U.S.-South Korea Group For its Chip Unit
Intel Showcases 10 nm Updates, a new aspect for Moore's Law, FPGA Progress and 64-Layer 3D NAND for Data Center
Apple Could be Behind Toshiba's MoU With Bain Capital's Consortium
Toshiba Signs Memorandum to Accelerate Memory Chip Sale Talks With Bain-Sk Hynix Group
Toshiba in Ongoing Discussions for Chip Business Sale
Toshiba MQ04 Hard Disk Drive Packs 1TB of Storage in a 7mm Design
Bain, SK Hynix Up Bid for Toshiba Chip Unit: sources
Foxconn, Apple, and SoftBank Pursue Acquisition of Toshiba Memory Unit
Western Digital Could Quit Bid for Toshiba Chip Unit, for Better JV Terms
Toshiba Reaches Agreement With Western Digital Group: report
Toshiba Puts Weight in Talks With Western Digital on Chips Business Sale

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .