Saturday, February 13, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Apple: Dr. Dre Starring In New TV Series; New iPhone, iPad Coming in March
Foxconn Seeks For Partner To Boost Bid For Sharp
Micron Outlines Tts First 3D NAND Products
AT&T To Start 5G Trials This Year
Uber Agrees to Settle Safety Lawsuits
Google To Expand Right-to-Be-Forgotten Removals Following Pressure From Europe
Apple And At&T Sued For Infringement of Touch Feedback Patents
LG Will Not Unveil LG Pay at MWC
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
 Home > News > Mobiles > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 08, 2013
Toshiba Is Sampling First UFS-compliant Embedded NAND Flash Memory Modules


Toshiba has started sample shipments of a 64GB embedded NAND flash memory module, the first equipped with a UFS I/F.

The module is fully compliant with the JEDEC UFS Ver.1.1 standard and is designed for digital consumer products including smartphones and tablet PCs.

The 64GB NAND flash memory chip boasts with ultra-speedy 3.0Gb/s interface. The module is sealed in a small FBGA package, 12x16x1.2mm, and have a signal layout compliant with JEDEC UFS Ver.1.1.

Universal Flash Storage is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba is offering the samples to OC vendors in order to evaluate the UFS I/F and its protocol in host chipsets. UFS I/F has a serial I/F, offreing scalability in the number of lanes and speed.

Toshiba has not yet decided when it will start mass production of the new 64GB UFS module.

Specifications

Interface: JEDEC UFS Version 1.1 standard

Power Supply Voltage:
2.7V to 3.6V (Memory core)
1.70V to 1.95V (Controller core)
1.10V to 1.30V (UFS I/F signals)

Number of lanes: Downstream 1 lane / Upstream 1 lane
I/F Speed: 2.9Gbps/lane
Temperature range: -25 degrees to +85 degrees Celsius
Package: 169Ball 12x16x1.2mm FBGA


Previous
Next
Twitter Now Showing Older Tweets In Search Results        All News        Seagate Set To Release Four-platter 4TB HDD
Spotify Comes To Windows Phone 8     Mobiles News      Blackberry 10 Won't Reach Japan

Get RSS feed Easy Print E-Mail this Message

Related News
Micron Outlines Tts First 3D NAND Products
768 Gbit Micron 3D NAND Is Faster Than Samsung’s 256Gb V-NAND: ISSCC
Toshiba To Wind Down Its Hard Disk Business
Toshiba Develops STT-MRAM Magnetic Cache Memory, Wireless Receiver For Bluetooth Low Energy
Toshiba To Focus On Memory Chips, Phase Out Hard Disk Manufacturing
Toshiba PX04SL SAS eSSD Series Now Available
3D NAND Flash Memory Market is Heating Up
Micron Envisions To Deliver 32GB SSDs
You Can Sell Your New BMW And Get A Pair Of Bang & Olufsen BeoLab 90 Speakers
Bang & Olufsen's Beosound 35 All-in-One Audio System Coming This April
CES: Toshiba Launches The dynaPad 12-Inch Tablet Powered by Windows
Toshiba Unveils Restructuring Plan

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .