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Thursday, April 11, 2013
Intel Expands Support of HTML5 with Launch of App Development Environment


At the second day of IDF Beijing, Intel launched the Intel HTML5 Development Environment that provides a cross-platform environment to develop, test and deploy applications that can run across multiple device types and operating system environments as well as be available in various application stores.

Based on web standards and supported by W3C, HTML5 makes it easier for software developers to create applications once to run across multiple platforms.

Doug Fisher, vice president and general manager of Intel's System Software Division, will opened the second day of IDF. He showcased Intel's support of multiple operating environments and the company's efforts to help developers scale and modernize computing with new hardware features and software advancements. He discussed how developers can incorporate touch and sensor interfaces to modernize applications, and use perceptual compute technologies to enable consumers to interact with PCs via voice control, gesture recognition and more.

Intel supports and actively invests in HTML5, while also helping application developers lower total cost and improve time-to-market for cross-platform app lication development and deployment. Based on Web standards and supported by W3C, HTML5 enables software developers to create applications once and deploy across multiple platforms with the potential to reach billions of devices, users and customers--a feat that is difficult to achieve due to the fragmented operating system environment.

Fisher introduced the Intel HTML5 Development Environment to make HTML5 development accessible to all developers. The solution provides a front-to-back and integrated cross-platform development environment to develop, test and deploy applications for multiple operating systems including iOS, Android, Windows 8 and Windows Phone 8. The Intel HTML5 Development Environment assists developers deploy applications through multiple application stores including Amazon Appstore, Apple App Store, Facebook, Google Chrome Web Store, Google Play Store and Windows Phone Store. The Intel HTML5 Development Environment is available to developers from the HTML5 zone on Intel Developer Zone with no license or usage fees.

Using complex technologies including near field communications (NFC), mobile payments and Intel Identity Protection Technology, Intel has also collaborated with a global bankcard network UnionPay, to make mobile payments both easy and secure. Speaking during Fisher ?s keynote, Hongfeng Chai, executive vice president of UnionPay, introduced the UnionPay Quick Pass service in which consumers can use a NFC smartphone powered by the Intel processor to pay for products everywhere from department stores to vending machines.

Intel Chief Technology Officer Justin Rattner also took the stage to discuss how Intel Labs is drawing up plans for a bright future. He revealed a vision for connected and sustainable cities where information technology helps to address challenges of clean air, clean water, better health and improved safety. He also explained how today's mobile, urban lifestyle is demanding faster and cheaper wireless broadband communications.

Forecasting a move beyond the information age, Rattner described a new era coined "the data society" and show how information in the cloud will work on everyone's behalf, collaboratively and safely, by analyzing and relating different data to deliver new value to individuals, enterprises and society as a whole.

Rattner also surprised the audience with an exclusive first look at Intel Silicon Photonics Technology. He demonstrated for the first time publicly a fully functional silicon photonics module incorporating Intel Silicon Photonics Technology (SPT) and operating at 100 gigabits per second (Gbps). This is a completely integrated module that includes silicon modulators, detectors, waveguides and circuitry. Intel believes this is the only module in the world that uses a hybrid silicon laser. The demonstration was made via a video during Rattner's keynote.



In addition to the Intel SPT module, Rattner showed the new photonics cable and connector that Intel is developing with Corning. This new connector has fewer moving parts, is less susceptible to dust and costs less than other photonics connectors. Intel and Corning intend to make this new cable and connector an industry standard. Rattner said the connector can carry 1.6 terabits of information per second.


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