Friday, August 26, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
NHK Join Forces With Panasonic And Sony To Win The 8K TV Race
Intel Introduces New 3D NAND SSDs
Facebook To Use Personal Data From WhatsApp To Bring You Personalized Ads
Amazon Introduces Car Research Portal
Google Uses Artificial Intelligence To Compress Images
Researchers Make Wi-fi Networks Faster And Stronger
Apple Weighs iPhone Video Editing App
Mozilla is Fighting To Reform The EU Copyright Law
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Nikon T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, July 05, 2013
Nikon To Release 450mm Immersion Scanner in 2017


Nikon had entered into a contract with the Research Foundation for the State University of New York (Research Foundation for SUNY) to provide a 450mm wafer ArF immersion scanner for process development and to be entrusted with wafer patterning subsequently received an order for the system.

Scheduled to be shipped in April 2015, the 450mm wafer ArF immersion scanner will be used by the member companies of the Global 450 Consortium (G450C) headquartered in the College of Nanoscale Science and Engineering (CNSE) for process development, characterization and demonstrations. Nikon will provide lithography solutions by sending its engineers to G450C. Nikon aims for the standardization of 450mm wafer ArF immersion scanners by offering early opportunities to develop 450mm process.

Announced by New York Governor Andrew M. Cuomo in September 2011 and located in the Albany NanoTech Complex at CNSE, G450C is a joint effort by Intel, IBM, GLOBALFOUNDRIES, TSMC and Samsung, involved in the next generation of computer chip technologies.



The goal of G450C is to support the industry transition from 300mm to the 450mm wafer platform, a crucial tipping point for the semiconductor manufacturing process, as smooth as possible. G450C plans to build advanced infrastructure in the Albany NanoTech Complex to demonstrate the capabilities of 450mm wafer platform and process.

Nikon expects to see increased orders for its systems from other device manufacturers in time for shipments of high volume manufacturing systems scheduled in 2017.

IC Insights research firm expects that 450mm wafer capacity will account for just one-tenth of a percent of global IC capacity in December 2017.


Previous
Next
Gorenje and Panasonic Enter Alliance        All News        UK's Privacy Watchdog Also Urges Google To Change Its Privacy Policy
Carl Icahn Says Dell Keeps Attacking Its Own Business     General Computing News      UK's Privacy Watchdog Also Urges Google To Change Its Privacy Policy

Get RSS feed Easy Print E-Mail this Message

Related News
Nikon Charges Into The Action Camera Market With The 360-Degree KeyMission 360
Nikon 1 J5 Mirrorless Camera Released
New Nikon Coolpix P900 Camera HAs An 83x Optical Zoom
Nikon Releases The D7200
Nikon Announces The 24MP Nikon D750 And The COOLPIX S6900
Nikon D810 HD-SLR Released
New Compact Nikon 1 J4 and Nikon 1 S2 Coming In The U.S.
Nikon Introduces The COOLPIX S810c Android And The Nikon 1 J4 Cameras
Nikon Introduces New 1 V3 Mirorless Digital Camera
Nikon Announces New Flagship D4s DSLR
Nikon Updates Coolpix line with Seven New Shooters
New Nikon D610 HD-SLR Promises FX-Format Quality and Pro-Level Features

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .