Wednesday, July 27, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Adds Artificial Intelligence Elements To New Smart Camera App
Xiaomi Announces Redmi Pro OLED Smartphone And Mi Notebook Air Laptop
Future Apple Stylus Could Operate as a Joystick
Twitter's Video Advertising Expansion Remains Slow
LG Display Invests KRW 1.99 Trillion in Flexible OLED Display Production
Nintendo Reports First-quarter Loss
Samsung To Release HDR+ Firmware Update for 2016 SUHD TVs
Apple To Invest In AI And AR As iPhone Sales Keep Declining
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC an...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, September 17, 2013
TSMC and OIP Partners Deliver 16FinFET and 3D IC Reference Flows


TSMC, the world's largest dedicated semiconductor foundry, today released three silicon-validated Reference Flows within the Open Innovation Platform (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.

Electronic Design Automation (EDA) vendors collaborated with TSMC to develop and validate all these flows through multiple silicon test vehicles.

The new Reference Flows are:

1. TSMC's 16FinFET Digital Reference Flow, providing technology support to address post-planar design challenges including extraction, quantized pitch placement, low-vdd operation, electromigration, and power management.

2. The 16FinFET Custom Design Reference Flow, offering full custom transistor-level design and verification including analog, mixed-signal, custom digital and memory.

3. The 3D IC Reference Flow, addressing emerging vertical integration challenges with true 3D stacking.

"These Reference Flows give designers immediate access to TSMC's 16FinFET technology and pave the way to 3D IC Through-Transistor-Stacking (TTS) technology," said TSMC Vice President of R&D, Dr. Cliff Hou. "Delivering our most advanced silicon and manufacturing technologies as early and completely as possible to our customers is a major milestone for TSMC and its OIP design ecosystem partners."

The 16FinFET Digital Reference Flow uses the ARM Cortex-A15 multicore processor as a validation vehicle for certification. It helps designers adopt the new technology by addressing FinFET structure related challenges of complex 3D Resistance Capacitance (RC) modeling and quantized device width. In addition, the flow provides methodologies for boosting power, performance and area (PPA) in 16nm, including low-voltage operation analysis, high-resistance layer routing optimization for interconnect resistance minimization, Path-Based Analysis and Graph-Based Analysis correlation to improve timing closure in Automatic Place and Route (APR).

The 16FinFET Custom Design Reference Flow enables custom design by addressing the complexity of 16FinFET process effects and provides methodologies for design compliance in 16nm manufacturing.

The 3D IC process produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. TSMC's 3D IC Reference Flow addresses integration challenges through 3D stacking. Key features include Through-Transistor-Stacking (TTS) technology; Through Silicon Via (TSV)/microbump and back-side metal routing; TSV-to-TSV coupling extraction.


Previous
Next
ASUS Updates PadFone Infinity With Snapdragon 800, microSD Slot        All News        Nokia Phablet Launch Scheduled For Next Month
Google Buys 240MW Texas Wind Farm     General Computing News      New Logo And Features For Microsoft Bing

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology
Samsung Lost iPhone 7 Chip Contract
TSMC Says Recent Earthquake Damaged Wafers
TSMC Wins Exclusive Chip Contract For Next iPhone: report
Chip Makers Differientate In terms Of Equipment Investments

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .