Wednesday, July 23, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
European Regulators May Need Extra Concessions From Google
Apple Granted Patent for Smartwatch
New Intel Solid-State Drive Pro 2500 Series Packs SK Hynix Flash And Brings Trusted Security Features
Alliance Storage Technologies Releases Enterprise Class Cloud-Integrated Storage Solution
NVIDIA Launches Shield Tablet For Gamers
AOC u3477Pqu 34-Inch WQHD Monitor Announced
ADATA Launches XPG V3 DDR3 Memory For Overclockers
Licensing Fees Drive ARM's Profit
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > Intel T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, November 21, 2013
Intel To Expand Its Contract Manufacturing Business, Unveils New Atom Chips


Intel CEO Brian Krzanich said on Thursday he planned to expand his company's contract manufacturing business, which features the most advanced process technology.

Intel's expansion to contract manufacturing has been rumored for some time now, as the move would ensure a significant revenue stream and would also offset the company 's slow reaction to market demand for mobile chips for smartphones and tablets.

Intel CEO Brian Krzanich, today told investors at Intel?s annual investor meeting:

"We're going to go much further. If we can utilize our silicon to provide the best computing, we'll do that," Krzanich told analysts. "People who can use our leading edge and build computing capabilities that are better than anyone else's - those are good candidates for our foundry service."

"Our view is that it's declining but it's beginning to show signs of stabilization," he said.

Krzanich said Intel will further improve its chip offerings for tablet makers and he pledged to quadruple the number of tablets with Intel chips in 2014.

Tablets with Intel chips would range in price from less than $100 to more than $400, he said.

Intel also unveiled upcoming mobile chips from its Atom line. With the new chips, Intel says it will boost mobile chip graphics performance by 15 times and CPU performance by five times by 2016.



The 64-bit Atom chips are based on new CPU and graphics cores and will appear in smartphones and devices starting in 2015. The lineup includes two high-performance mobile chips and the first Atom chip with an integrated modem, which will be for low-priced entry-level devices.

By the end of 2014, Intel will ship a high-performance mobile chip code-named "Cherry Trail," which will be based on an upcoming CPU code-named "Airmont." The chip will pack Intel's next-generation graphics.

Cherry Trail will be succeeded by a faster chip code-named "Broxton," which will ship in mid-2015 and be based on a new CPU core code-named "Goldmont." Broxton will be built into what Intel executives called a "chassis" to which other components can be easily connected.

Starting from 2014, a high-performance dual-core 22nm chip code-named "Merrifield" will appear in smartphones. A quad-core variant of Merrifield will ship in the second half of next year.

For entry-level smartphones, Intel will release "Sofia" in late 2014. Sofia will beinitially be manufactured outside of Intel in order to be available sooner, sometime in 2014. Intel will later move production of SoFIA chips to its own 14 nanometer manufacturing lines, Krzanich said. The chip will be initially paired with a 3G x86 communications core, which will be upgraded to LTE in 2015.




Previous
Next
GLOBALFOUNDRIES Demonstrates Model for Next-Generation Chip Packaging Technologies        All News        Xbox One Is Luxuriously Spacious Inside
GLOBALFOUNDRIES Demonstrates Model for Next-Generation Chip Packaging Technologies     PC Parts News      LaCie Doubles Capacity of Rugged USB 3.0 Thunderbolt Series

Get RSS feed Easy Print E-Mail this Message

Related News
New Intel Solid-State Drive Pro 2500 Series Packs SK Hynix Flash And Brings Trusted Security Features
New Intel Haswell CPUs Released
Intel to $60 Ship Galileo Gen2 Computer Next Month
Intel Reports Second-Quarter Revenue of $13.8 billion
Intel Chipsets To Support PCIe 3.0
Intel To Manufacture Future Panasonic SoCs Using Intel's 14nm Low-Power Process
Intel Details Next-Generation Xeon Phi Processor with Integrated Omni Scale Fabric
Intel Adds Laughter into Mobile Messaging
Intel Offers Customizable Chips For Data Centers
Intel Raises Revenue Expectations Thanks To XP Retirement
Intel Focuses On Energy Efficiency In Semiconductors At VLSI 2014
European Court Upholds Record Fine Imposed On Intel

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .