Tuesday, April 24, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
First-Quarter Lobbying Expenditures: Google, AT&T, Comcast and Comcast Remain Top Spenders
Samsung Launches Six Original Series on Samsung VR Video Service on Gear VR
Facebook Says Users Are Not Products, the Social Network Is
European Regulators Investigate Apple's Proposed Acquisition of Shazam
Amazon is Working on Home Robots: report
7nm Volume Production to Fuel TSMC's Profits This Year
Toshiba Weighs Memory Chip Unit Options
Google Chat Launches to compete with Apple's iMessage
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 18, 2014
Samsung Works With GLOBALFOUNDRIES On 14 nm FinFET Offering


Samsung Electronics and GLOBALFOUNDRIES today announced a new collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology.

The advanced 14 nm FinFET technology will be available at both Samsung and GLOBALFOUNDRIES. The collaboration will leverage the companies' semiconductor manufacturing capabilities, with volume production at Samsung's fabs in Hwaseong, Korea and Austin, Texas, as well as GLOBALFOUNDRIES' fab in Saratoga, New York.

Developed by Samsung and licensed to GLOBALFOUNDRIES, the 14 nm FinFET process is based on a technology platform that has already gained traction as the choice for high-volume, power-efficient system-on-chip (SoC) designs. The platform taps the benefits of three-dimensional, fully depleted FinFET transistors to overcome the limitations of planar transistor technology, enabling up to 20 percent higher speed, 35 percent less power and 15 percent area scaling over industry 20 nm planar technology.

The platform is the first FinFET technology in the foundry industry to provide true area scaling from 20 nm. The technology features a smaller contacted gate pitch for higher logic packing density and smaller SRAM bitcells to meet the demand for memory content in advanced SoCs. According to Samsung, the technology is also leveraging the interconnect scheme from 20 nm to offer the benefits of FinFET technology with reduced risk and the fastest time-to-market.

Through this multi-year exclusive technology license, process design kits (PDKs) are available now. Mass production for the 14 nm FinFET technology will begin at the end of 2014.

"This unprecedented collaboration will result in a global capacity footprint for 14 nm FinFET technology that provides AMD with enhanced capabilities to bring our innovative IP into silicon on leading-edge technologies," said Lisa Su, senior vice president and general manager of Global Business Units at AMD. "The work that GLOBALFOUNDRIES and Samsung are doing together will help AMD deliver our next generation of groundbreaking products with new levels of processing and graphics capabilities to devices ranging from low-power mobile devices, to next-generation dense servers to high-performance embedded solutions."

"This strategic collaboration extends the value proposition of a single GDSII multi-sourcing to the FinFET nodes. With this true multi-source platform, Samsung and GLOBALFOUNDRIES have made it easy for fabless semiconductor companies to access FinFET technology and increase first-time silicon success," said Dr. Stephen Woo, president of System LSI Business, Device Solutions Division, Samsung Electronics. "Through this collaboration, we are advancing the foundry business and support model to satisfy what customers have been asking for."

"Today's announcement is further proof of the importance of collaboration to enable continued innovation in semiconductor manufacturing," said GLOBALFOUNDRIES CEO Sanjay Jha. "With this industry-first alignment of 14 nm FinFET production capabilities, we can offer greater choice and flexibility to the world's leading fabless semiconductor companies, while helping the fabless industry to maintain its leadership in the mobile device market."

Intel, which has some of the most advanced manufacturing plants in the world, is already making 14-nanometer chips. They'll be introduced this year for PCs.

TSMC, which is the world's largest foundry supplier, will start producing 3D transistors this year using a 16-nanometer process.

Intel and TSMC each use different 14-nm and FINFET technologies, so their customers don't have the option to use other companies' fabs.



Previous
Next
Xbox One Wolrdwide Sales Cross 5 million        All News        Facebook To Find Nearby Friends
Sharp Improves LCD Viewing Angle With New Optical Film     General Computing News      Facebook To Find Nearby Friends

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung QLED TVs Receive '100 Percent Color Volume' Certification
Samsung Not Interested in Nokia's Health Unit
Samsung to Release Its First MicroLED TVs in 2018
Samsung Galaxy J2 Pro Smartphone Has no Data Connectivity
Samsung 360 Round 3D Video Camera and Samsung DeX Pad Now Available
Samsung Reports Profit on High Memory Sales
Samsung Launches the Notebook Odyssey Z for Gaming
Samsung Notebook 5 and Notebook 3 Target General Users
Samsung Breaks Ground in New Memory fab Line in Xian
Samsung Electronics Shareholders Approve Stock Split, Company Talks About Future for Smartphones, Chips
New Samsung Exynos 7 Series 9610 Mobile Processor focuses on Multimedia
Samsung Expands its 8-Inch Foundry Offerings with New RF/IoT and Fingerprint Technology Solutions

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .