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Wednesday, April 13, 2016
Meizu's Pro 6 Released With A 10-core Processor

The new Meizu Pro 6 smartphone has been announced in Beijing today. It comes with a 5.2-inch Super AMOLED display and a unibody metal design.

Meizu says that the headset has 48 percent less plastic in its design, while on the inside it also has a matching technology for Apple's 3D Touch with its own 3D Press. The Pro 6 is powered by a 10-core MediaTek Helio X25 processor, with Meizu claiming it will be the first deca-core smartphone on the market.

The super thin phone is measuring only 7.25mm in thickness. On the inside, the Pro 6 has 4GB of RAM and either 32GB or 64GB of storage to go with its multicore processor. The camera has a 21-megapixel Sony IMX230 sensor. Phase-detect autofocus and new image-processing algorithms contribute to a focusing speed of just 0.07 seconds, which also comes with a 10-LED ring flash.

Other upgrades include a new fingerprint sensor with a 0.2-second recognition time and the addition of mCharge 3.0, which will take the phone's 2,560mAh battery from empty to full in under an hour.

Meizu's Pro 6 also sports a 1920 x 1080 resolution and accepts two nano-SIM cards. It handles audio though
a Cirrus Logic CS43L36 chip.

The Meizu Pro 6 is priced at CNY 2,499 ($390) with 32GB of storage or CNY 2,799 ($430) with 64GB.

Meizu PRO 6
SoC MediaTek Helio X25
2x A72 @ 2.5GHz
4x A53 @ 2.0GHz
4x A53 @ 1.4GHz

Mali T880MP4 @ 700MHz
NAND 32 / 64GB eMMC 5.1 NAND
Display 5.2” 1080p AMOLED
Modem 2G/3G/4G LTE Cat 6
(Integrated MediaTek SoC Modem)
Dimensions 147.7 (h) x 70.8 (w) x 7.25 (d) mm
Camera Rear Camera
21.16MP ( 5444 x 4016 )
Sony IMX230 1/2.4" 1.12µm pixels
F/2.2 aperture
w/ Laser & Phase Detection focus
Front Facing Camera
5MP 1.4µm pixels
F/2.0 aperture
Battery 2560mAh (~9.85 Whr)
Launch OS Android 6.0 with FlyMe 5.6
Connectivity 802.11a/b/g/n 2.4 & 5GHz
USB-C 3.1
SIM Size NanoSIM + NanoSIM

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