Friday, September 21, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
PlayStation Now Adds Downloading of PS4, PS2 Games
U.S. Music Industry Dominated by Streaming
Amazon Announces New Echo Devices, New Alexa Features
AR Headset Prevalence is Still a Few Years Out
Alibaba and Intel Cloud Deliver Joint Computing Platform for AI Inference at the Edge
GoPro Launches New Hero 7 Black, Silver and White Cameras
Xiaomi Launches the Mi 8 Lite And Mi 8 Pro Smartphones in China
Airbnb to Comply with European Commission Demands, Facebook and Twitter Need to Do More
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Games > Microso...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, August 23, 2016
Microsoft Provides Glimpse Of 24-core Processor For HoloLens


Microsoft today gave the first peek inside the custom vision processor it designed for its HoloLens augmented reality headset.

The chip handles a trillion pixel-operations/second in a power budget lower than the 4W Intel Atom-based Cherry Trail SoC that acts as its host processor.

The HoloLens processing unit (HPU) fuses input from five cameras, a depth sensor and motion sensor, compacting and sending it to the Intel SoC. It also recognizes gestures and maps environments including multiple rooms.

Microsoft described the internal oarts of HoloLens earlier this year, but has not until now publicly detailed its HPU.

The TSMC 28nm chip packs 24 Tensilica DSP cores and 8 Mbytes cache into a 12x12mm package with 65 million transistors. A GByte of LPDDR3 is included in the HPU’s package.

The Tensilica cores were picked in part due to their flexibility. Microsoft added 300 custom instructions to the cores.

“If you can’t add custom instructions, the math density you wind up with is not what you need,” said Nick Baker, a distinguished technologist at Microsoft who described the HPU in a talk at the Hot Chips event in San Francisco.

The chip uses a mix of standalone accelerators and ones tightly coupled to its DSPs, getting an overall 200x speedup over a software-only version.

The chip is used in the $3,000 HoloLens developer’s kit released in March.



Previous
Next
Opera VPN App For Android Released        All News        Nvidia Unveils Parker, The Latest SOC For Autonomous Vehicles
PlayStation Now Coming to PC, DualShock 4 USB Wireless Adaptor Unveiled     Games News      Sony To Launch Two New PS4 Models Next Month

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft Announces With New AI, HoloLens Features
Microsoft HoloLens Provides Access to Raw Image Sensor streams with Research Mode
Intel to Release its First Dedicated GPU In 2020, Next Playstation to Have AMD SoC Inside, and New Xbox and Hololens Stories
Microsoft HoloLens Expands Availability in Europe
Second Version of HoloLens HPU Will Incorporate AI Coprocessor For implementing DNNs
Microsoft Unveils First Windows Mixed Reality Dev Kit
Microsoft Unveils Tool to Help Others See What You See in HoloLens
Minimum PC Specs For Microsoft's Windows 10 VR Headsets Are User-friendly
Microsoft HoloLens Coming In More Countries
Microsoft HoloLens Development Edition Updates Now Opened to Everyone In the United States and Canada
Microsoft Opens Windows Holographic to Partners, Skype And Office Coming To Xiaomi Android Smarphones
Microsoft's BUILD 2016 Conference Kicks Off

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .