Friday, April 28, 2017
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Qualcomm Slashes Profit Expectations As Apple Refuses To Pay Royalty Payments
Kodi Clarifies DRM Stance, Shuts Down Rumors
ASML Countersues Nikon Over Alleged Patent Infringement
Image Sensors, Batteries And Playstation Boosts Sony's Profit
Cost Cuts Start Paying Off For Sharp
New Nintendo 2DS XL Gaming Handheld System Coming On July 28
KINGMAX Targets Gamers With ZEUS DDR4 Modules
Microsoft Cloud Strength Highlights Third Quarter Results
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Games > Microso...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, August 23, 2016
Microsoft Provides Glimpse Of 24-core Processor For HoloLens

Microsoft today gave the first peek inside the custom vision processor it designed for its HoloLens augmented reality headset.

The chip handles a trillion pixel-operations/second in a power budget lower than the 4W Intel Atom-based Cherry Trail SoC that acts as its host processor.

The HoloLens processing unit (HPU) fuses input from five cameras, a depth sensor and motion sensor, compacting and sending it to the Intel SoC. It also recognizes gestures and maps environments including multiple rooms.

Microsoft described the internal oarts of HoloLens earlier this year, but has not until now publicly detailed its HPU.

The TSMC 28nm chip packs 24 Tensilica DSP cores and 8 Mbytes cache into a 12x12mm package with 65 million transistors. A GByte of LPDDR3 is included in the HPU’s package.

The Tensilica cores were picked in part due to their flexibility. Microsoft added 300 custom instructions to the cores.

“If you can’t add custom instructions, the math density you wind up with is not what you need,” said Nick Baker, a distinguished technologist at Microsoft who described the HPU in a talk at the Hot Chips event in San Francisco.

The chip uses a mix of standalone accelerators and ones tightly coupled to its DSPs, getting an overall 200x speedup over a software-only version.

The chip is used in the $3,000 HoloLens developer’s kit released in March.

Opera VPN App For Android Released        All News        Nvidia Unveils Parker, The Latest SOC For Autonomous Vehicles
PlayStation Now Coming to PC, DualShock 4 USB Wireless Adaptor Unveiled     Games News      Sony To Launch Two New PS4 Models Next Month

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft Unveils First Windows Mixed Reality Dev Kit
Microsoft Unveils Tool to Help Others See What You See in HoloLens
Minimum PC Specs For Microsoft's Windows 10 VR Headsets Are User-friendly
Microsoft HoloLens Coming In More Countries
Microsoft HoloLens Development Edition Updates Now Opened to Everyone In the United States and Canada
Microsoft Opens Windows Holographic to Partners, Skype And Office Coming To Xiaomi Android Smarphones
Microsoft's BUILD 2016 Conference Kicks Off
Microsoft Actiongram Allows Creation Of Augmented Reality Tales
Microsoft HoloLens Developer Kits To Start Shipping For $3,000
Microsoft To Bring Windows 10 to Public Sector Customers in China
Microsoft And Volvo Bring HoloLens To Car Showrooms
A Closer Look At Microsoft HoloLens

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .