Thursday, December 14, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Disney to Buy Fox Film and Some TV Businesses for $52 billion
Powerful iMac Pro is Available Today, Starting at $5,000
IBM Announces Collaboration With Leading Companies to Accelerate Quantum Computing
Bing Gets Intelligent Search Features, Powered by AI
New MediaTek Sensio Solution Brings Health Monitoring to Smartphones
LG's Upgraded Gram Laptop Deliver Longer Battery Life, More Power
New Samsung Notebook 9 Pen and Notebook 9 Released
T-Mobile Enters The pay-TV Market With the Acquisition of Layer3 TV
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC To...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, December 12, 2016
TSMC To Build New Fab for 3nm


Taiwan Semiconductor Manufacturing Co. (TSMC) plans to build its next fab for chips made at the 5nm to 3nm technology node by 2022.



TSMC's new fab site will be built in a new science park planned by the Taiwan government near the city of Kaohsiung.

TSMC will need 50 to 80 hectares (123 to 198 acres) of land for an investment worth about NT$500 billion ($15.7 billion).

TSMC is pushing the Taiwan government to have land and supplies of electricity ready in time for the new project. In the past, TSMC has faced shortages of water and power in Taiwan, where the company still does most of its production.

TSM is still undecided on whether it will adopt extreme ultraviolet (EUV) lithography for 5 nm and 3 nm. The company's
current plan is to use EUV extensively for 5 nm, assuming that EUV will be ready.

The company said that it will ramp 7 nm in 2017, followed by 5 nm in 2019, to support smartphones and high-end mobile products with new features, including virtual reality and augmented reality.

Chipmakers TSMC, Samsung, and Intel are in a tight race to lead process technology development and grab profitable business from fabless customers such as Apple and Qualcomm.

For now, the world?s leading chipmakers are aiming for the lead in 10 nm.

In the third quarter this year, TSMC transferred 10nm development from R&D to production and has five tape outs lined up for mobile products. The first commercial shipments of 10nm products are scheduled for the first quarter next year. The company predicted that high-end smartphones will move to 10 nm from 16 nm during 2017.

Samsung aims to ship before the end of the year SoCs made in a 10nm FinFET process, beating rivals such as Intel and TSMC. Intel, earlier this year, said that its 10nm process could outperform other foundries and will be used to make ARM-based mobile chips for companies including LG Electronics.



Previous
Next
Sony Leads The VR Market        All News        EU fines Rechargeable Battery Makers Over Cartel
Japan Display to Buy JOLED     General Computing News      EU fines Rechargeable Battery Makers Over Cartel

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC to Invest $20bn in 3nm Chip Plant
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Apple Praises TSMC's Investments, Says iPhones Will be AI an Platform
TSMC Raises Forecasts for 2017 Due to 10nm Demand, Outlines 7 and 5nm Roadmap
TSMC Chairman Dr. Morris Chang to Retire
TSMC to Build 3nm Fab in Taiwan
Globalfoundries Asks EU to Probe TSMC
TSMC Updates its Roadmap, Talks About First 7nm Chips and EUV Migration
TSMC InFO packaging Enters Second Generation
TSMC Q2 Sales Slowed as Industry Expects the iPhone Launch
Samsung and TSMC Are Playing Catch-up to Make the Smallest Chip
Samsung Foundry Focuses on 6nm Process to Beat TSMC

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .