Wednesday, March 21, 2018
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Apple Watch Bands Feature Spring Colors and Styles
European Commission Proposes Measures to Ensure Companies Pay Fair Tax in the EU
VIVE FOCUS Coming To International Markets Later This Year
Qualcomm's New Snapdragon 845 Virtual Reality Development Kit Coming In Q2
South Korea Fines Facebook Over Unfair Practices
Futuremark Releases DirectX Raytracing Tech Demo
Samsung Expands its 8-Inch Foundry Offerings with New RF/IoT and Fingerprint Technology Solutions
Intel and Facebook Unveil Next Generation OCP Twin Lakes 1S Server
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > TSMC, M...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, January 11, 2017
TSMC, Mentor Graphics To Enable Design and Verification Tools for New InFO Technology Variants

TSMC has extended its collaboration with Mentor Graphics on the Xpedition Enterprise platform in conjunction with the Calibre platform for the design and verification of TSMC's InFO (Integrated Fan-Out) packaging technology for multi-chip and chip-DRAM integration applications.

Mentor developed new Xpedition functionality specifically to support InFO and enable the IC package designer to complete design tasks to TSMC specification.

"TSMC's InFO packaging supports diverse industry needs," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "An InFO solution based upon package tools such as the Xpedition Enterprise and sign-off Calibre platforms from Mentor Graphics helps our customers meet their time-to-market goals."

The Mentor Graphics Xpedition Enterprise platform is a used design flow for PCB, IC package, and multi-board system-level design, from architecture authoring through implementation to manufacturing execution. The integration of the Xpedition Enterprise platform for design with the HyperLynx tool suite and Calibre platform for analysis and verification provides advantages to designers implementing InFO designs:

  • Xpedition generates InFO layouts meeting TSMC design rule requirements;
  • Streamlined in-design InFO-specific manufacturing verification using HyperLynx DRC expedites time to closure, reducing DRC iterations during the design stage;
  • Calibre DRC, LVS, and 3DSTACK solutions provide sign-off-level die and InFO package DRC and layout vs. schematic (LVS) inter-die connectivity verification to ensure TSMC-required accuracy and a DRC-clean GDS to improve first-time success rates;
  • Direct highlighting and cross-probing of Calibre tools into packaging design cockpit results reduces time to foundry-ready signoff;
  • Integration to thermal analysis and thermally-aware post-layout simulation flows provides early identification of potential heat issues;
  • System-level signal path tracing, extraction, simulation, and netlist export ensures complete InFO package signal integrity.

Facebook Journalism Project Aims At A Healthy News Ecosystem        All News        LG G6 Smartphone To Be Launched In The 10th of March
Facebook Journalism Project Aims At A Healthy News Ecosystem     General Computing News      Samsung Vice Chairman Suspect in Political Probe

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Breaks Ground on 5nm Fab 18 in Southern Taiwan Science Park
TSMC Could Outpace Samsung in 7nm Volume Production This Year
TSMC to Invest $20bn in 3nm Chip Plant
Samsung Foundry in Advanced Discussions With New Customers for 7nm Chips
Apple Praises TSMC's Investments, Says iPhones Will be AI an Platform
TSMC Raises Forecasts for 2017 Due to 10nm Demand, Outlines 7 and 5nm Roadmap
TSMC Chairman Dr. Morris Chang to Retire
TSMC to Build 3nm Fab in Taiwan
Globalfoundries Asks EU to Probe TSMC
TSMC Updates its Roadmap, Talks About First 7nm Chips and EUV Migration
TSMC InFO packaging Enters Second Generation
TSMC Q2 Sales Slowed as Industry Expects the iPhone Launch

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .