Wednesday, September 20, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Pimax Launches First 8K VR Headset
New Amazon Fire HD 10: 1080p Full HD Display, Faster Performance, for $150
CyberLink Introduces 360 Video Editing Tools with PowerDirector 16 and Director Suite 6
Pioneer Introduces New CDJ-2000NXS2-W and DJM-900NXS2-W
AUO Presents 85-inch 8K4K Bezel-less TV Display
South Korean Government Wants to Stop Technology "Leaks" to China
Fujitsu Develops Wearable, Hands-Free Speech Translation Device
Dell Sees Solid Growth in Worldwide PC Monitor Market
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Western...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, February 06, 2017
Western Digital Introduces First 512 Gigabit 64-Layer 3D NAND Chip


Western Digital has kicked off pilot production of the industry's densest 3D NAND flash chips, which stack 64 layers atop another and enable three bits of data to be stored in each cell.



The company's 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) is produced in Yokkaichi, Japan, with mass production expected in the second half of 2017.

Stacking NAND flash cells -- versus planar or 2D memory -enables manufacturers to increase density, which enables lower cost per gigabyte of capacity.

The latest 3D NAND chips have been used to create gum stick-sized SSDs with more than 3.3TB of storage and standard 2.5-inch SSDs with more than 10TB of capacity.

Samsung became the first company to announce it was mass-producing 3D flash chips in 2014. Their V-NAND technology originally stacked 32-layers of NAND flash. Samsung's V-NAND also crammed 3-bits per cell in what the industry refers to as triple-level cell (TLC) NAND or multi-level cell (MLC) NAND. Because Samsung uses TLC memory, its chips were able to store as much as Toshiba's original 48-layer 3D NAND chips, which stored 128Gbits or 16GB.

Intel and Micron also produce 3D NAND.

Western Digital's chip was developed jointly with the company's technology and manufacturing partner Toshiba. Western Digital first introduced initial capacities of the first 64-layer 3D NAND technology in July 2016 and the first 48-layer 3D NAND technology in 2015; product shipments with both technologies continue to retail and OEM customers.

Western Digital will present a technical paper on the advancement in high aspect ratio semiconductor processing that made this technology achievement possible on February 7, at the International Solid State Circuits Conference (ISSCC).



Previous
Next
LG Display Is Setting Up First Production Lines for 10th Generation OLEDs        All News        Xiaomi Develops 'Pinecone' Mobile Processor in House
Lenovo Showcases New Products and a VR-ready Mobile WorkstationAt SOLIDWORKS World 2017     PC Parts News      New Lenovo Yoga A12 Android Tablet Offers Productivity At A Good Price

Get RSS feed Easy Print E-Mail this Message

Related News
Western Digital Ships 12TB WD Gold Hard Drives
Western Digital Could Quit Bid for Toshiba Chip Unit, for Better JV Terms
Western Digital Releases 400GB microSD Card
New Western Digital My Cloud Home Makes It Easy To Save All Content In One Place
Western Digital to Acquire Tegile System
Toshiba Reaches Agreement With Western Digital Group: report
Toshiba Puts Weight in Talks With Western Digital on Chips Business Sale
Toshiba Launches 8TB X300 Desktop HDD, Western Digital Introduces New 20TB My Book Duo System
Western Digital Announces Four-bits-per-cell Technology On 3D NAND
Toshiba in Talks with Western Digital, Foxconn Over Memory Unit Sale
Western Digital Responds to Toshiba's Actions
Western Digital Announces First 96-Layer 3D NAND Technology

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .