Thursday, December 14, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Disney to Buy Fox Film and Some TV Businesses for $52 billion
Powerful iMac Pro is Available Today, Starting at $5,000
IBM Announces Collaboration With Leading Companies to Accelerate Quantum Computing
Bing Gets Intelligent Search Features, Powered by AI
New MediaTek Sensio Solution Brings Health Monitoring to Smartphones
LG's Upgraded Gram Laptop Deliver Longer Battery Life, More Power
New Samsung Notebook 9 Pen and Notebook 9 Released
T-Mobile Enters The pay-TV Market With the Acquisition of Layer3 TV
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > SK Hyni...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, April 10, 2017
SK Hynix Introduces First 72-Layer 3D NAND Flash


South Korea's No. 2 chipmaker SK hynix Inc. said Monday it has developed the first 72-layer 256Gb 3d NAND flash, which will be mass-produced in the second half of this year.

The new chip 72-Layer 3D NAND uses 1.5 times more cells than the company's 48-Layer 3D, which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB storage. It achieves approximately 30 percent more manufacturing productivity over its predecessor 48-Layer. Also by bringing high-speed circuit design into the new chip, its internal operation speed is two times faster and read/write performance is 20 percent higher than a 48-Layer 3D NAND chip.

However, competitors have a smaller cell size than SK Hynix, which makes their 3D NAND production more difficult.

Stacking 72 layers in a flash chip is an industry-firts for SK hynix, but the 256Gb capacity is not. Toshiba's 64-layer flash die has a 512Gb capacity and it is a TLC (3bits/cell) device like the new SK Hynix chip.

Toshiba's foundry partner Western Digital also started early production runs of a 512Gb, 64-layer die in February.

Samsung has also a 512Gb, 64-layer flash chip.

SK Hynix launched 36-Layer 128Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016.

3D NAND demand will rapidly increase across AI (Artificial Intelligence), big data and cloud storage in the 4th industrial revolution. According to Gartner, NAND Flash market revenue is expected to total USD 46.5 billion in this year and post continuous growth to amount to USD 56.5 billion in 2021.



Previous
Next
E Ink and Sony to Establish a Joint Venture to Operate Electronic Paper Display Business        All News        Dallas Emergency Siren System Hacked
E Ink and Sony to Establish a Joint Venture to Operate Electronic Paper Display Business     General Computing News      Dallas Emergency Siren System Hacked

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Unveils UFS Devices Based on 64-Layer, 3D Flash Memory
Samsung, SK Hynix and Micron Lead the Server DRAM Market
SK hynix Reports Record Profits for Q3
SK Hynix to Invest 395 billion yen in Toshiba chip unit
SK hynix Reports Record Q2 Results on Strong Chip Sales
Toshiba Develops First 3D Flash Memory with TSV Technology
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
Broadcom, KKR and SK Hynix - Bain Join Final Bidding Round for Toshiba's Memory Unit
3D-NAND to Become Mainstream This Year
SK Hynix Reports Strong First Quarter Results
SK Hynix Offers More Than $9 billion for Toshiba Chip Unit: report

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .