Thursday, August 24, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New 6.3-inch Samsung Galaxy Note 8 Comes With Dual Camera, Enhanced S Pen
GPU Shipments Increased from Previous Quarter
LG to Establish Factory for Electric Vehicle Components in the U.S.
Microsoft Unveils Project Brainwave for Real-time AI
Panasonic Touts 1TB Optical Disc For Storing Cold Data
Google to Detail Titan Security Chip for Cloud Services
Toshiba Puts Weight in Talks With Western Digital on Chips Business Sale
Micron Expands its NVDIMM-N Portfolio
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > SK Hyni...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, April 10, 2017
SK Hynix Introduces First 72-Layer 3D NAND Flash


South Korea's No. 2 chipmaker SK hynix Inc. said Monday it has developed the first 72-layer 256Gb 3d NAND flash, which will be mass-produced in the second half of this year.

The new chip 72-Layer 3D NAND uses 1.5 times more cells than the company's 48-Layer 3D, which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB storage. It achieves approximately 30 percent more manufacturing productivity over its predecessor 48-Layer. Also by bringing high-speed circuit design into the new chip, its internal operation speed is two times faster and read/write performance is 20 percent higher than a 48-Layer 3D NAND chip.

However, competitors have a smaller cell size than SK Hynix, which makes their 3D NAND production more difficult.

Stacking 72 layers in a flash chip is an industry-firts for SK hynix, but the 256Gb capacity is not. Toshiba's 64-layer flash die has a 512Gb capacity and it is a TLC (3bits/cell) device like the new SK Hynix chip.

Toshiba's foundry partner Western Digital also started early production runs of a 512Gb, 64-layer die in February.

Samsung has also a 512Gb, 64-layer flash chip.

SK Hynix launched 36-Layer 128Gb 3D NAND chips in April 2016, and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016.

3D NAND demand will rapidly increase across AI (Artificial Intelligence), big data and cloud storage in the 4th industrial revolution. According to Gartner, NAND Flash market revenue is expected to total USD 46.5 billion in this year and post continuous growth to amount to USD 56.5 billion in 2021.



Previous
Next
E Ink and Sony to Establish a Joint Venture to Operate Electronic Paper Display Business        All News        Dallas Emergency Siren System Hacked
E Ink and Sony to Establish a Joint Venture to Operate Electronic Paper Display Business     General Computing News      Dallas Emergency Siren System Hacked

Get RSS feed Easy Print E-Mail this Message

Related News
SK hynix Reports Record Q2 Results on Strong Chip Sales
Toshiba Develops First 3D Flash Memory with TSV Technology
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
Broadcom, KKR and SK Hynix - Bain Join Final Bidding Round for Toshiba's Memory Unit
3D-NAND to Become Mainstream This Year
SK Hynix Reports Strong First Quarter Results
SK Hynix Offers More Than $9 billion for Toshiba Chip Unit: report
Toshiba Informs SK hynix of New Plan to Sell Memory Business
Western Digital Releases New iNAND 7350 Storage Solution Built on 3D NAND
Toshiba Starts Sampling 64-Layer, 512-gigabit 3D Flash Memory
SK hynix Bids for Stake in Toshiba's Memory Chip Business

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .