Saturday, October 20, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Could Charge Android Partners in Europe up to $40 per Device
Samsung Display Develops Under Panel Sensor, Fingerprint On Display AMOLEDs
The 9th Generation Intel Core i9-9900K is Actually the World's Best Gaming Processor
European Commission Approves Acquisition of GitHub by Microsoft
Samsung, LG Launch Trade-in Promotions to Help Sales Of Latest Flagship Smartphones
Fujitsu's Cooling Control Technology Reduces Datacenter Energy Consumption
Tesla Unveils new $45,000 Model 3
Micron Wants to Buy Remaining Interest in IM Flash Technologies to Advance the 3D XPoint Technology
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, June 27, 2017
Samsung Foundry Focuses on 6nm Process to Beat TSMC


Samsung Electronics has failed to attract 7nm chip orders from major clients such as Qualcomm, so the company's foundry department is already focusing on the next step - the 6nm process.

Samsung's 6nm process will be based on the 7nm technology, so the improvements over the 7nm in terms of production cost, electric efficiency and performance are difficult to be estimated.

The South Korean company aims at start mass-production of the 6nm chips by 2019.

Samsung failed to secure customers for its 7nm process as many of them chose rival TSMC. TSMC offers 10nm chips only to Apple (iPhones) and focused its resources to the 7nm process, skipping a potential 8nm step. Through this strategy, TSMC received supply orders from Qualcomm's early 7nm chips.

Samsung will invest in two new ASML NXE3400B Extreme Ultraviolet (EUV) systems this year and will install more to its foundry facilities next year.

The NXE:3400B system is expected to eventually have an estimated throughput of 145 wafers/hour, capable of creating overlays within a 3nm tolerance. ASML believes that the new systems will circumvent complex and expensive 0.33 NA EUV multiple patterning, enabling chip makers to print all the way down to the sub-3nm logic node in a single exposure.

However, it is not cleat whether the first version of the systems will be so efficient. Engineers expect they will have to use multi-patterning with the 0.33 NA systems before the second generation arrives sometime around 2024.

TSMC did not use EUV equipment for its first 7nm process. It used immersion equipment featuring a higher limit of resolution by utilizing an ArF (Argon Fluoride) excimer laser that has light wavelength of 193nm and immersion technology. But if
EUV equipment is not used foir the 7nm process, quadruple patterning technology that performs multiple exposure processes should be applied, boosting the overall production cost. TSMC is planning to commercialize its first 7nm process next year and will shift to EUV equipment for its second generation 7nm process. TSMC plans to start mass production of 7nm chips in 2019.


Previous
Next
Fujitsu Virtual Machine Control Technology Improves Server Density        All News        Sprint Starts Partnership Talks With US Cable TV Providers Charter Communications and Comcast
Fujitsu Virtual Machine Control Technology Improves Server Density     General Computing News      Western Digital Resubmits Bid for Toshiba Chip Unit

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Display Develops Under Panel Sensor, Fingerprint On Display AMOLEDs
Samsung Debuts the Galaxy Book2, an always on, always connected 2-in-1 PC With Snapdragon 850
Samsung Debuts 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM at Samsung Tech Day
Samsung Expands Exynos and ISOCELL Brands to Include Automotive-Grade Solutions
Samsung Mobile CEO Confirms New Foldable Phone will Also be a Tablet
TSMC Said to be the Sole Maker of the 7nm Apple A13 Chips
Samsung Chromebook Plus V2 Gets "Always On" LTE Connectivity
Samsung A9 Smartphone Comes With Four Rear Cameras
Samsung to Use the Galaxy Brand In VR and Camera Products
Samsung Profit Bolstered by Memory-Chip Sales
TSMC Tapes out First 5nm Chip, Outlines Packaging Techniques
Samsung to Preview Foldable Smartphone in November

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .