Tuesday, March 20, 2018
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Focuses on News Publishers With New Initiative
Lite-On to Unveil New NVRAM Hybrid Solid-State Drive at OCP 2018
Seagate Demonstrates New Helium-based, 14TB Exos X14 Hard Drive at OCP Summit 2018
Samsung's Ruggedized Galaxy Tab Active2 Now Available in the U.S.
Samsung Debuts First 3D Cinema LED Screen Theater in Switzerland
Toshiba Launches KumoScale NVM Express over Fabrics Storage Software for Cloud Infrastructures
HP's Latest Laser Printers Are as Tall as Your Smartphone
IDC Sees a Bright Future for Smartwatches
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Micron ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, January 08, 2018
Micron and Intel to Limit Their NAND Memory Joint Development Program

Micron and Intel today announced that will develop 3D NAND independently after 2019, ending their 3D NAND joint development partnership.

The companies have agreed to work independently on future generations of 3D NAND. The companies have agreed to complete development of their third-generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently "in order to better optimize the technology and products for their individual business needs."

Micron and Intel expect no change in the cadence of their respective 3D NAND technology development of future nodes. The two companies are currently ramping products based on their second-generation of 3D NAND (64 layer) technology.

Both companies will also continue to jointly develop and manufacture 3D XPoint at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which is now entirely focused on 3D XPoint memory production.

ASUS at CES 2018        All News        CES 2018: HyperX Unveils Infrared Synchronized DDR4 RGB Memory, Wireless Headset and RGB Gaming Gear
ASUS at CES 2018     PC Parts News      CES 2018: HyperX Unveils Infrared Synchronized DDR4 RGB Memory, Wireless Headset and RGB Gaming Gear

Get RSS feed Easy Print E-Mail this Message

Related News
Intel to Bring Hardware-based Protection to Data Center and PC Processors
Microsoft Uses AI to Match Human Performance in Translating News from Chinese to English
Samsung Expands Xian Flash Memory Plant
Buying Broadcom Could be an Option for Intel, If Qualcomm Deal Fail
Intel Releases Meltdown and Spectre fixes for Ivy Bridge, Sandy Bridge
Intel Optane SSD 800P Released
Intel Has Made a Server as Easy to Upgrade as a Light Bulb
Alibaba Cloud Launches Cloud and AI Solutions in Europe
Intel Eyes China Partnerships As Flash Memory Pact With Micron Ends
Intel Introduces 'Intel AI: In Production' Program to Bring AI Devices to Market
Intel Ships First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV
Intel to Bring 5G Technology at the 2020 Tokyo Olympics

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .