Tuesday, March 20, 2018
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Focuses on News Publishers With New Initiative
Lite-On to Unveil New NVRAM Hybrid Solid-State Drive at OCP 2018
Seagate Demonstrates New Helium-based, 14TB Exos X14 Hard Drive at OCP Summit 2018
Samsung's Ruggedized Galaxy Tab Active2 Now Available in the U.S.
Samsung Debuts First 3D Cinema LED Screen Theater in Switzerland
Toshiba Launches KumoScale NVM Express over Fabrics Storage Software for Cloud Infrastructures
HP's Latest Laser Printers Are as Tall as Your Smartphone
IDC Sees a Bright Future for Smartwatches
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 23, 2018
Samsung Breaks Ground on New EUV Line in Hwaseong

Samsung Electronics broke ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to start production of 7nm chips in 2020.

Samsung expects the new facility to be completed within the second half of 2019 and start production ramp-up in 2020. The compay says that the initial investment in the new EUV line is projected to reach USD 6 billion by 2020, with additional investment to be determined depending on market circumstances.

Samsung has decided to utilize cutting-edge EUV technology starting with its 7-nanometer (nm) LPP (Low Power Plus) process. This new line will be set up with EUV lithography equipment to overcome nano-level technology limitations.

The company is also working with US chip giant Qualcomm on a 5G mobile chipset that will be made using the 7-nanometer process. Samsung developed a 8-nanometer process last October.

With this huge investment, Samsung appears to be preparing for a possible downturn in the memory chip market, as well as sharpening its competitive edge against the world's leading contract chipmaker, Taiwan Semiconductor Manufacturing Co.

Samsung is currently the world's fourth-place contract chipmaker, but aims to reach the No. 2 spot behind TSMC.

Apple (iPhones) is possibly the largest client of both Samsung and TSMC. The Taiwanese company has scored a string of wins in recent years, and appears to be in the lead for 2018 models of the smartphone as well, but some see Samsung staging a comeback with 2019 iPhone models.

About EUV

When producing semiconductor chips, silicon-based round disks, called "wafers" are coated with a light-sensitive substance and enter a system called a "scanner." Inside the scanner, a laser light source is cast onto the wafers to create patterns of circuitries, which later are used for forming billions of ultrafine, microscopically small structures, inside a semiconductor chip. This process, while described very concisely, is known as photolithography.

With EUV technology, a EUV system, or EUV scanner, will now be able to perform the photolithography step by utilizing a light source with an 'extreme ultraviolet' wavelength. In the world of chip manufacturing, realizing finer circuits is a must, as it enables integration of a greater number of components inside a chip and therefore building faster and more energy efficient chip.

The utilization of an EUV light source will allow for defining finer and denser patterns than previous methods because of its shorter wavelength, which is essential since light isn't able to directly define features smaller than its own wavelength. Upcoming EUV scanners will, specifically, utilize EUV radiation at a 13.5-nanometer wavelength, less than 1/10th of what current ArF excimer laser scanners are able to provide.

First Affordable Android Go Smartphones Coming Next Week        All News        Samsung Max Android Application Offering Mobile Data Saving Mode and Privacy
Xiaomi and Microsoft Expand Their Collaboration in cloud, Devices and AI Areas     General Computing News      EASA Publishes Guidelines for Safe Drone Operations

Get RSS feed Easy Print E-Mail this Message

Related News
Imec and Cadence Tape Out First 3nm Chip
IMEC Researchers Optimistic About Dealing With EUV Defects in 5nm Node
IBM Researchers Talk About the Future of EUV at SPIE
Samsung and Qualcomm Expand Foundry Cooperation on EUV Process Technology
ASML Buys Stake In Carl Zeiss To Advance EUV Lithography Efforts
ASML Makes Progress on EUV
EUV Lithography Moves Forward To Keep Moore's Law Marching
ASML To Deliver At Least 15 EUV Lithography Systems To U.S. Chip Maker
Canon is Developing Semiconductor Lithography Equipment Employing Nanoimprint Technology
ASML Says First EUV Production Systems Will Be Ready in 2016

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .