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Monday, June 11, 2018
HiSilicon Kirin 710 Expected to Take On Snapdragon 710


Huawei's HiSilicon Technologies will reportedly launch its new mid-tier Kirin 710 SoC for smartphones by the end in July and, responding to Qualcomm's Snapdragon 710 solution.

Digitimes.com reports that the Kirin 710 is based on Huawei's chipset architecture and Cortex A73 CPUs, and is built on TSMC's 12nm process. The SOC is expected to feature a NPU (neural processing unit) built-in, as in the case of the current high-end solution Kirin 970.

The first Kirin 710-powered model is likely to be Huawei's nova 3 (codenamed Paris), which is expected to be launched in July, featuring 19.5:9 all-screen display and supporting dual-lens camera.

Huawei also has two models of its smartphones (series numbers PRA-AL00 and PRA-TL00) been verified for meeting 3C (China Compulsory Certification) standards.

Qualcomm's Snapdragon 710 SoC will be built using a 10nm node at Samsung Electronics and will feature a multi-core AI engine and neural network processing capabilities. Qualcomm clams that the Snapdragon 710 has been engineered to offer substantial performance improvements without sacrificing battery life, using cores based on the Cortex A75 and A55.

The first phone to be announced with the Snapdragon 710 is likely to be Xiaomi Technology's Mi 8 SE, followed by a model from Oppo.



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