According to Intel, the new Intel Core i7 processor Extreme Edition has up to 35 percent better 3D rendering performance (vs. Intel Core i7-5960X processor) for 4K gameplay while accomplishing other compute-intensive tasks in the background.

Forty PCIe lanes connected directly into the CPU allow for system expansion with fast SSDs, up to four discrete GFX cards and Thunderbolt 3.0 technology. Intel Smart Cache of up to 25MB and quad-channel memory improves responsiveness and decreases startup time when working with large files and applications. The new Intel Turbo Boost Max Technology 3.0 steers applications to the highest-performing core, improving single-threaded performance by up to 15 percent.

The Intel Core i7-69xx/68xx processor family is also unlocked, an important feature for enthusiasts who want the extra headroom and tools to push their system to the limit.

Features:

• 10-, 8-or 6-core options
• Intel Turbo Boost Max Technology 3.0
• Up to 40 PCI Express 3.0 lanes
• 4 channel DDR4-2400 memory support
• Fully unlocked for performance
• Up to 25 MB Intel Smart Cache
• Intel Hyper-Threading Technology
• Supports LGA 2011-v3 socket
• Intel Ready Mode Technology
• Intel X99 Chipset compatibility

Below you see the new Core i7 processor Extreme Edition lneup. Systems and boxed processors are available now:

Overclocked at 5.7GHz

Intel's new 10-core 3GHz Broadwell-E gaming chip have been pushed to 5.7GHz during Computex. Intel is sponsoring an event where invited overclockers will get a chance to put the new chip through its paces over the course of the Computex trade show.

Tanks of liquid nitrogen stood on the ready to help overclockers keep the processors cool.

Roman Hartung, a product engineer from Berlin's CaseKing, kept the Core i7 6950X chip running at around -110 degrees Celsius.

On previous Haswell-E chips, overclockers had found that the chip would drop performance when the temperature dropped below a certain point, leading them to heat the chip up a little and get the speed back.

Kaby Lake on track for 2017 launch

Intel also demonstrated at Computex the 7th Gen Intel Core processors (code named Kaby Lake) for the first time and highlighted some of the advancements in performance, battery and media capabilities to come to premium devices in the second half of 2016.

At the same time as it makes Kaby Lake chips available for desktop PCs, Intel also plans to launch its cheaper Apollo Lake processors, enabling features like USB-C in 2-in-1 devices and tablets.

Intel says its forthcoming Kaby Lake processors will offer advances in performance, battery life, and media capabilities, while also supporting functions like Windows Hello to make logging into your devices faster.

The Kaby Lake processors will be Intel's third 14nm chips to hit the market - following the Broadwell and the Skylake 14nm chips. Intel's upcoming CPUs will form a second optimizing "tock" before the company shrinks its chipsets further to 10nm in 2017.

Kaby Lake has native USB 3.1 support, native HDCP 2.2 support, native Thunderbolt 3 support, and a thermal design power of up to 95 watts. A typical desktop processor will sport four cores and support Intel’s Optane technology.

Optane is based on a non-volatile memory technology called 3D XPoint (pronounced 3D Cross Point). A desktop seated on stage at Computex contained one Optane SSD inside and an external Optane SSD connected by way of a Thunderbolt 3 port, and managed to move 26GB of data from the internal to the external drive at 1.94GB per second. A second machine with standard NAND-based SSDs could only move data at a slower 287MB per second.

MSI is also demonstrating a Kaby Lake-compliant z210 motherboard on the Computex show floor with a release date of November.

Taiwanese ECS is also showcasing the APL-MINI for the embedded market. The motherboard is based on the the Apollo Lake low-end Pentium / Celeron processors.

The Apollo Lake processors are expected to arrive sometime after the second quarter of 2016. According to ECS, the The Apollo Lake processors will be optimized for decodign of 4K video. The platform is promising better performance and graphics in the company’s Celeron and Pentium processors when compared to the previous generation. Apollo Lake promises lower power consumption too for a longer battery life in low-cost laptops and desktops slated to arrive later this year.

Intel Xeon processor E3-1500 v5 product family

To cost-effectively accelerate video and enable secure, remote delivery of graphic-intensive applications, Intel also introduced the Intel Xeon processor E3-1500 v5 product family.

By combining the performance of Intel Xeon processors with the graphics power of Intel Iris Pro graphics P580, Intel’s most advanced graphic processor, the product family enables service providers to pack more video streams into a single server or appliance for a minimized data center footprint and reduced power consumption.

While HD (1080p) video is predominant today, UHD (or 4K video) is quickly emerging along with 3D and virtual reality. Intel is investing ahead of broad 4K video delivery by enabling hardware-enhanced High Efficiency Video Codec (HEVC) transcoding of 4K video on the new Intel Xeon processor E3-1500 v5 family.

The product family can deliver two real-time HEVC streams for 4K 30 frame-per-second (FPS) video and up to 18 AVC streams for taking 1080p 30 frame-per-second video and transcoding it into HEVC at the same resolution.

It also delivers increased performance for remote application delivery with up to 26 percent more performance (vs. the Xeon processor E3-1200 v4 family) available to complex CAD and content creation applications in virtualized environments.

As an example, Intel showed a 360-degree live-streamed virtual reality jazz concert delivered from the legendary Blue Note Jazz Club in New York to Computex using hardware-assisted 4K video delivery on Intel Xeon E3v5 servers.

For developers of video transcoding software, Intel Media Server Studio simplifies development of media applications by giving transcoding features for tailoring image quality versus performance. This suite of development tools supports both Linux and Windows. It also provides access to the Intel Iris Pro graphics and Intel Quick Sync Video media accelerators for high-speed media transcode.

For remote workstations, the Intel Xeon processor E3- 1500 v5 product family promises workstation-class visual experiences. Intel Graphics Virtualization Technologies (Intel GVT) allows users to dedicate the resources of each processor to a single designer or engineer, or share them among groups of users.

Developers can pick one or more techniques from the Intel GVT portfolio to best suit their respective solutions and business models:

• Intel Graphics Virtualization Technology –d (Intel GVT -d) - provides the highest possible performance for engineers and content creators, assigning a dedicated physical graphics processing unit (GPU) to their virtual machine (VM).
• Intel Graphics Virtualization Technology –g (Intel G VT-g) - enables collaboration among engineers and content creators, allowing up to seven users to share a single graphics processor simultaneously.
• Intel Graphics Virtualization Technology –s (Intel GVT -s) - supports a large number of knowledge workers using common office applications (e.g.,Microsoft Office and Chrome Browser).

Besides the features, the Intel Xeon processor E3-1500 v5 family, based on the Skylake microarchitecture, integrates graphics acceleration with Intel Iris Pro Graphics P580 and enhances energy-efficiency and performance with Intel’s 14nm transistor technology.

The product family offers up to 26 percent more overall graphics performance than the previous generation Intel Xeon processor E3-1200 v4 product family.

For dense and high-capacity media processing in the network and cloud, the new processor family delivers up to 18 advanced video coding (AVC) streams or 8 HEVC streams at 1080p 30 FPS, or 2 HEVC streams at 4K 30 FPS.

When paired with the Intel®C236 series chipset, the product family supports new, faster memory performance, with up to 64 GB of DDR4 at 2133 MHz. The chipset also provides faster connectivity and flexibility with integrated I/O technologies, such as PCI Express Gen 2.0, 6.0 Gbps SATA 6.0, and USB 3.0 with Intel Flex I/O.

The new family includes five SKUs. Two of the SKUs are designed for cloud service providers. For comms service providers who require network infrastructure solutions be deployed for up to 7-10 years, the product family offers three long-life solutions at a variety of power
envelopes:

"Things" are getting smarter and more connected

The many “things” that make up today’s PC business and IoT industry are made more valuable by their connection to the cloud, whether they are found in the home, car, business or anywhere else.

Intel announced the Intel AnyWAN GRX 750 system-on-a-chip (SoC) family and the Intel XWAY WAV500 Wi-Fi chipset - Intel’s new 5th Generation 11ac MU-MIMO Wi-Fi family of products for home gateways.

The Intel AnyWAN GRX750 SoC enables local and cloud-based services, media creation and content sharing for tools ranging from ultra-high-definition devices to "things" in a person’s home.

For the transportation segment, Intel announced a collaboration with Taiwan-based Chunghwa Telecom and SanJet Technology Corp. to create a connected telematics service using a low-cost Intel Atom x3 processor for IoT (formerly known as SoFIA). The device will provide drivers with a customized insurance policy based on driving behavior and car usage. Intel continues to expand Intel Atom x3 processor-based solutions for products like point-of-sale systems, healthcare tablets and industrial devices within the IoT.

5G will transform mobility

Where 4G was about moving data faster, 5G will bring more powerful wireless networks that connect "things" to each other, to people and to the cloud. 5G will transform our lives by helping deliver a smart and connected society with smart cities, self-driving cars and new industrial efficiencies. For this to happen, networks must become faster, smarter and more agile to handle the unprecedented increase in volume and complexity of data traffic as more devices become connected and new digital services are offered.

During Computex, Intel announced an agreement with Foxconn to collaborate on the development of network infrastructure technologies to accelerate this transition. The companies will collaborate on proof of concepts and pilot programs for technologies like Mobile Edge Computing, Cloud Radio Access Network (CloudRAN) and Network Functions Virtualization (NFV) that will enable more intelligent, efficient and flexible networks. Through these efforts, Intel and Foxconn aim to make it easier for communications service providers and their solution providers to re-architect their networks now and start preparing for 5G.