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Samsung to Open $380 Million Home Appliance Manufacturing Plant in South Carolina
Dolby Atmos Coming to Netflix
Toshiba Delays Chip Unit Deal, Sues Western Digital
Qualcomm Debuts the Snapdragon Wear 1200 and the Snapdragon 450 Mobile Platforms
Samsung Launches ISOCELL Image Sensor Brand
Toshiba Announces 96-Layer 3D Flash Memory and 64-Layer QLC 3D Flash Memory
Western Digital Announces First 96-Layer 3D NAND Technology
New Intel SSD 545s Packs 64-layer 3D TLC Flash
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Last 7 Days News : SU MO TU WE TH FR SA All News
Sunday, May 14, 2017

Samsung Electronics is rumored to implement - for the first time - a dual-camera system in its next flagship smartphone Galaxy Note 8.

South Korean semiconductor package company NEPES has commercialized Fan-out panel-level packaging (FOPLP) technology, one of the more controversial topics being discussed in the advanced semiconductor packaging world.

A few days ago, an outbreak of the Trojan encryptor WannaCry started. Security experts called it an epidemic since the extent of it is quite huge, with over 100,000 cases of the attack in just one day. Are you safe?

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