Altera and Intel To Make Multi-Die Devices - Printer Friendly version without Comments

Appeared on: Wednesday, March 26, 2014
Altera and Intel To Make Multi-Die Devices

Altera and Intel will collaborate on the development of multi-die devices that leverage Intel's package and assembly capabilities and Altera's programmable logic technology.

The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera's work with Intel will enable the development of multi-die devices that integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics.

Intel's 14 nm Tri-Gate process density advantage and Altera's patented FPGA redundancy technology enable Altera to deliver the industry's highest density monolithic FPGA die, offering greater integration of system components on a single die. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.

"Our partnership with Altera to manufacture next-generation FPGAs and SoCs using our 14 nm Tri-Gate process is going exceptionally well," said Sunit Rikhi, vice president and general manager, Intel Custom Foundry. "Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging. Together, both companies are building off one another's expertise with the primary focus on building industry-disrupting products."