Samsung Electronics today announced a network processor tape-out based on Samsung's 14LPP (Low-Power Plus) process technology in collaboration with eSilicon and Rambus.
This achievement is built on Samsung's foundry process and design infra for network applications, eSilicon's complex ASIC and 2.5D design capability with its IP solutions, and Rambus' high-speed 28G SerDes solution.
Samsung's 14LPP process technology based on 3D FinFET structure has already been proven for its high performance and manufacturability through mass production track record. The next generation process for network application is 10LPP process which is based on 10LPE (Low-Power Early) of which mass production was started from last year for the first time in the industry. 10LPP process' mass production will be started in this year end.
Additionally, Samsung named its newly developed full 2.5D turnkey solution, which connects a logic chip and HBM2 memory with an interposer, as I-Cube (Interposer-Cube) solution. This 14LPP network process chip is the first product that Samsung applied I-Cube solution together with Samsung's HBM2 memory. The solution will be essential to network applications for high-speed signaling, and it is expected to be adopted into other applications such as computing, server and AI in the near future.