Intel is providing a sneak peek of its upcoming Lakefield client platform, based on the Foveros 3D packaging technology, detailed at CES 2019.
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Two years after its offifial announcement, the ultra-fast USB 3.2 is finally coming to PCs later this year.

The USB-IF standards body has announced that...

Western Digital has added the new Ultrastar DC SN630 NVMe and the CL SN720 NVMe SSDs to its portfolio products for data center and cloud...

BIOSTAR launches the gaming-ready A10N-8800E SoC motherboard.

The BIOSTAR A10N-8800E sports a compact mini-ITX form-factor designed for small-form-factor gaming PCs and HTPCs. The A10N-8800E...

Lenovo unveiled at MWC 2019 new product launches from across its portfolio - from PCs and smart devices to cutting edge Data Center technology and...

The SSD is featuring TLC (Triple-Level Cell) 3D NAND Flash and a host of other features to deliver value and performance.

The SU750 is essentially...

CORSAIR has released the DOMINATOR PLATINUM RGB DDR4 Memory. designed for custom PC enthusiasts.

The new DDR4 memory features an updated aluminum heatspreader, hand-sorted...

SK Hynix detailed its first synchronous DRAM chip based on the DDR5 specification at the International Solid State Circuits Conference in San Fransisco.

The...

Toshiba Memory Corp. has developed a small bridge chip that offers high-speed and increases the capacity of SSDs.

Using bridge chips with a small...