Manufacturer of chip-making equipment ASML Holding NV today announced at SEMICON West lithography, metrology and new software solutions, designed to enable chip makers to develop, optimize and control the production process at the 7/5 nanometer (nm) logic and 16 nm DRAM nodes.

ASML's TWINSCAN NXE:3400B EUV lithography system offers the resolution that chip makers need for the most critical layers of a chip, while the new TWINSCAN NXT:2000i DUV immersion system features redesigned leveling and alignment sensors.

This enables DUV/EUV cross-matching on-product overlay of 2.5 nm that addresses a mix-and-match production environment for advanced nodes. The lithography systems are complemented by ASML's new YieldStar 375F metrology system, featuring new optics technology that ASML claims it generates more accurate metrology data faster to support the company's patterning control loop. Additionally, Hermes Microvision (HMI), which was acquired by ASML last year, expects to ship the new HMI eP5 e-beam metrology system later this year. This system features higher resolution and larger field of view electron optics technology that supports OPC model calibration and pattern fidelity metrology.

The TWINSCAN NXE:3400B and YieldStar 375F are currently shipping to ASML's logic and memory customers worldwide. The HMI eP5 is expected to ship in the second half of this year. The TWINSCAN NXT:2000i has an ongoing early access program. The first TWINSCAN NXT:2000i that is completely built in ASML's factory is expected to ship in 2018.