Baidu, a leading Chinese-language Internet search provider, and Samsung Electronics, today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year.

Baidu KUNLUN chip is built on the company’s XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per second (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to infer three times faster than the conventional GPU/FPGA-accelerating model.

Leveraging the chip’s limit-pushing computing power and power efficiency, Baidu can support a wide variety of functions including large-scale AI workloads, such as search ranking, speech recognition, image processing, natural language processing, autonomous driving, and deep learning platforms like PaddlePaddle.

Through the first foundry cooperation between the two companies, Baidu will provide advanced AI platforms for maximizing AI performance, and Samsung will expand its foundry business into high performance computing (HPC) chips that are designed for cloud and edge computing.

“We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”

Samsung’s I-Cube technology, which connects a logic chip and high bandwidth memory (HBM) 2 with an interposer, provides higher density/ bandwidth on minimum size by utilizing Samsung’s solutions.

Compared to previous technology, these solutions maximize product performance with more than 50% improved power/signal integrity. It is anticipated that I-Cube technology will mark a new epoch in the heterogeneous computing market. Samsung is also developing more advanced packaging technologies, such as redistribution layers (RDL) interposer and 4x, 8x HBM integrated package.