Today at CES Toshiba Memory America introduced the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series.

Toshiba Memory’s new lineup of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centers.

Utilizing Toshiba Memory’s innovative 96-layer BiCS FLASH 3D memory, BG4 increases the maximum capacity from 512 gigabytes to 1024GB (approximately 1TB)3 and provides a slim 1.3mm profile for capacities up to 512GB. Furthermore, the BG4 series doubles the PCIe Gen3 lane count from 2 to 4, delivering more performance in the same power envelope when compared to the prior generation product.

Performance improvements over the BG3 series include:

• Up to 2,250 megabytes per second sequential read (50 percent improvement) and up to 1,700MB/s sequential write performance6 (70 percent improvement)
• Up to 380,000 random read IOPS (153 percent improvement) and 190,000 random write IOPS7 (90 percent improvement)

BG4 SSDs feature a power-saving solution that improves power efficiency up to 20 percent in read and 7 percent in write and provides a low-power state 10 as low as 5mW (when compared to the BG3 series). The BG4 also improves its Host Memory Buffer (HMB) technology by increasing the accelerated read access range and optimizing background flash management. Additionally, BG4 includes new enhanced reliability features to protect against host DRAM failures when using the HMB feature.

Toshiba Memory’s new single package SSD is available in capacities of 128GB, 256GB, 512GB, and 1024GB (1TB), in either surface-mount BGA M.2 1620 (16 x 20mm) or removable M.2 2230 (22 x 30mm) modules. Pyrite drive (version 1.00) or self-encrypting drive (TCG Opal version 2.01) models are also available.