Rambus has signed a license agreement with STMicroelectronics, which expands the ST relationship with CRI, furthering its adoption of DPA countermeasures into multimedia chipsets and...

Rambus and SK Hynix have signed a five-year patent license agreement for the use of Rambus memory-related patented technologies in SK Hynix semiconductor products and...

The Northern District of California (NDCA) today affirmed previous findings that the Rambus patents involved in a case against SK Hynix are valid and infringed...

At the Mobile World Congress (MWC) 2013, Rambus is demonstrating the Imerz multi-media platform as well as a binary pixel technology that improves the quality...

Rambus has signed a patent license agreement with LSI Corporation. This agreement allows LSI Corporation to include Rambus patents in all its products. In addition,...

Rambus today announced its first LPDDR3 offering targeted at the mobile industry. The R+ LPDDR3 memory architecture is fully compatible with industry standards while providing...

Rambus on Thursday announced it signed a six-year patent licensing agreement with Fujitsu Semiconductors, which will use Rambus technology in chips and integrated circuits. The...

Rambus destroyed records that could have been evidence in its patent dispute with Hynix Semiconductor, a U.S. judge ruled, but the court has not yet...

Technology licensing company Rambus Inc. today announced a restructuring of the company, which includes cost saving measures. "After reviewing our expenses in detail, we have...

LSI and STMicroelectronics did not infringe on patents claimed by Rambus, according to a ruling by the U.S. International Trade Commission on Wednesday. In its...