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ADATA and MSI Launch the World’s First 4-RANK DDR5 CUDIMM Memory Module Akasa Introduces Kepler: A 2U Rackmount Fanless Case Designed for Silent Computing in Industrial Applications LIAN LI Introduces the Platinum Certified SX PSU Series Micron Ships Automotive UFS 4.1 Apple introduces Digital ID

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3nm

Imec and ASML Enter Beyond-3nm EUV Lithography Collaboration

Imec and ASML Enter Beyond-3nm EUV Lithography Collaboration

Oct 24,2018 0
Research organization Imec and lithography equipment manufacturer ASML plan to establish a joint research lab to explore printing nanoscale devices towards the post-3nm logic node...
Samsung Talks About Process Technology Roadmap,  Down to 3-nanometer Using GAA

Samsung Talks About Process Technology Roadmap, Down to 3-nanometer Using GAA

Sep 4,2018 0
The Samsung Foundry Forum 2018 Japan was held in Tokyo and Samsung disclosed details about its silicon innovations that will be at the heart of...

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Latest Content

ADATA and MSI Launch the World’s First 4-RANK DDR5 CUDIMM Memory Module
PC components

ADATA and MSI Launch the World’s First 4-RANK DDR5 CUDIMM Memory Module

Akasa Introduces Kepler: A 2U Rackmount Fanless Case Designed for Silent Computing in Industrial Applications
Cooling Systems

Akasa Introduces Kepler: A 2U Rackmount Fanless Case Designed for Silent Computing in Industrial Applications

LIAN LI Introduces the Platinum Certified SX PSU Series
PC components

LIAN LI Introduces the Platinum Certified SX PSU Series

Micron Ships Automotive UFS 4.1
Enterprise & IT

Micron Ships Automotive UFS 4.1

Apple introduces Digital ID
Enterprise & IT

Apple introduces Digital ID

DJI Launches Neo 2
Drones

DJI Launches Neo 2

PlayStation Plus Game Catalog for November 2025
Gaming

PlayStation Plus Game Catalog for November 2025

Seagate Launches Next-Generation Edge Enterprise Storage, Engineered for Tomorrow’s Data Challenges
Enterprise & IT

Seagate Launches Next-Generation Edge Enterprise Storage, Engineered for Tomorrow’s Data Challenges

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