Wednesday, September 17, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony To Offer Unity For PlayStation To PlayStation Licensed Developers
Blackberry Introduces Elegant Porsche Design P9983 Smartphone
Club 3D Launches 4K Docking Station
Logitech Gives You Control of Your Smart Home with the New Harmony Living Home Lineup
New iPads And OS X Yosemite Announcements Expected Next Month
Opera Max Data-savings App to be Embedded into MediaTek's LTE SoCs
Nero 2015 Supports Burning via Smartphone, WiFi Streaming
PMC Delivers 16-port SAS and SATA Storage Controllers
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > Kingmax...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, January 20, 2006
Kingmax DDRII 667 Notebook Memory


Kingmax says it is prepared for the challenges of the Napa age.

Intel?s recent announcement of its new mobile platform ? Napa ? has propelled the already rapidly developing mobile technology industry into the third generation. The announcement also implies that dual-core systems will soon be available for notebooks. In just one year, Intel has exceeded Moore?s Law in the evolution from Sonoma to Napa.

The Napa architecture consists of three components, the CPU, chipset and wireless module, all of which have been updated with the new generation? the Intel 945 series chipset, Intel Core processor and Intel 3945ABG wireless module. The biggest differences between Napa and the second-generation Sonoma platform are the upgrade of the front-side bus to 667MHz, support for PCI Express x16 and DDRII 667 memory. The Intel Core will be available in single and dual-core configurations built on a 65 nm process. The Intel Pro/Wireless 3945ABG wireless module is compatible with 802.11a/b/g wireless protocols. Most importantly, the Napa platform modules are small, providing more flexibility for a wider variety of notebook designs, and the new platform provides a reduction in power consumption of 1.2W, leading to longer battery life.

If the Sonoma platform brought notebooks into the DDRII age, Napa presents another leap forward in notebook memory specifications, as DDRII 667 is expected to follow the growth of the Napa platform to become the mainstream memory of choice for notebooks. The advantage of DDRII memory in mobile platforms is its low-power advantages. However, mass production of notebook DDRII memory is no simple feat. Currently only a handful of memory manufacturers have the capacity to mass-produce DDRII 667 SO-DIMM modules.

Packaging and testing requirements for notebook DDRII 667 memory pose considerable challenges for memory makers. It is well known by now that BGA is the default packaging format for DDRII memory. What this means is that, in the DDRII era, only companies who possess substantial BGA packaging technology capabilities will be able to achieve broad market acceptance. Only those companies who have accumulated years of technology experience and possess the core BGA packaging technologies will be able to compete.

Kingmax is one of the companies who possess these advantages. Kingmax has a vertically integrated supply chain. The company operates its own packaging facilities and handles the entire manufacturing process from purchasing and dicing of wafers, testing and packaging to finished product testing. Kingmax developed BGA packaging technology eight years ago and has successfully utilized it in the mass production of its SDRAM and DDR products.

Kingmax announced its latest Venus series DDRII 667 SO-DIMM modules at the 2005 Computex Taipei exhibition. Since then, Kingmax has completed all the preparations for mass production and the Kingmax DDRII 667 SO-DIMM modules are now available on the market. This memory series provides all of the functions for the latest memory trends in terms of data transfer frequencies, application performance and compatibility.

Kingmax?s next generation DDRII memory architecture technology complies with JEDEC standards for DDRII 667 SO-DIMM high-specification memory, and supports lower working voltage design (1.8V), which can reduce power consumption by approximately 50%. With a working frequency of 333MHz, the SO-DIMM memory can take advantage of up to 5.3GB of memory bandwidth with its 200pin configuration. Additionally, integrated ODT (on-die-termination) technology maintains memory signal waves at high speeds, minimizing noise interference.

Kingmax DDRII 667 SO-DIMM Notebook Memory Features
200-pin 667MHz DDRII
CAS Latency: 5
Voltage: 1.8V, reduces power consumption by approximately 50%
Capacity: 256MB/512MB/1GB
High degree of compatibility and stability
Global lifetime warranty


Previous
Next
BenQ Introduces New LCD Monitors        All News        Imation Buys Memorex
AMD Interested in Z-RAM Memory Technology     PC Parts News      NVIDIA Announces nForce4 SLI XE & nForce4 Ultra

Get RSS feed Easy Print E-Mail this Message

Related News
KINGMAX Announces The SMG TITAN SSDs
Kingmax Releases Upgraded PRO Extreme SDXC Cards
KINGMAX Introduces PI-03, Super Mini Flash Drive
KINGMAX Launches The Power Bank Portable Battery Charger
KINGMAX PRO Extreme Series SD, MicroSD Memory Cards Released
KINGMAX Launches ECC SO-DIMM For Micro Servers
New Kingmax mSATA MMP30 SSD Targets Ultrabooks, Tablets
Kingmax UI-05 USB Flash Drive Let's You See Memory Inside
KINGMAX Launches New SATA III Client Pro SSD
KINGMAX Launches the MMP20 mSATA SSD
KINGMAX Unveils SATA III SSD
Kingmax Unveils 2400MHz DRAM Module Without Heatsink

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .