Sunday, October 04, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Buys Havok
Google Officially Becomes Alphabet
Microsoft Works On A Laptop Battery System That Adapts To Your Habits To Last Longer
Motorola Outlines Android Marshmallow Update Plans
AMD FirePro Graphics Powers New Dell Precision Mobile Workstations
Globalfoundries Said To Move To 10nm Development On Its Own
Nvidia Launches New Maxwell-based Quadro graphics For Mobile workstations
Microsoft Expands Licensing Agreements With Asus, I-O Data
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 01, 2013
Toshiba Showcased 128Gb 19nm NAND Flash At Nano Tech

Toshiba showcased a 300mm wafer that had 128-Gbit NAND flash memory chips and was made by using 19nm process technology at "nano tech 2013 ? The 12th International Nanotechnology Exhibition & Conference", the world's biggest exhibition of nanotechnology, that was held at the Tokyo Big Sight from January 30 to February 1.

The company employed the 19nm process technology as well as a 3bit/cell multiple-level cell (MLC) technology. Compared to 2bit/cell MLC flash, the 3bit/cell MLC flash chips can be rewritten fewer times, meaning that the new flash is mostly suited for USB flash drives or flash cards, where absolute costs and density are the most important thing, and the performance and endurance are still adequate.

Toshiba claims that its 19nm process technology offers the same reliability as its previous 24nm process. The Japanese company used a structure that separates floating gates with air gaps to reduce the interference between memory cells.

Toshiba has been also working on the reduction of package thickness by stacking NAND chips in several layers. The company has managed to maintain a slim package for its 128-Gbyte memory by staking 16 layers of 30µm-thick 64-Gbit chips using a wire bonding technology.

Google Works With EU To Settle Antitrust Probe        All News        OCZ Technology Provides Estimated Financial Information
New 180GB Capacity Added to Intel SSD 335 Series     PC Parts News      OCZ Technology Provides Estimated Financial Information

Get RSS feed Easy Print E-Mail this Message

Related News
New Samsung 950 PRO SSD Reads At 2500MBps
Toshiba's Satellite Click 10 Detachable 2-in-1 PC Now Available
Toshiba Reports Q1 Loss on Weak PC, TV Sales
Toshiba Reports Significant Loss Following Accounting Scandal
Toshiba's New PCs Combine Functionality, Mobility and Performance
Toshiba At IFA 2015
Samsung Offers USB Flash Drive Family
Toshiba Launches Wireless Power Receiver IC for Quick Charging Mobile Devices
Samsung Rolls Out Line-up of V-NAND SSDs For Data Centers
Samsung Begins Mass Producing 256-Gigabit, 3D V-NAND Flash Memory
Toshiba Unveils Three NVME Solid State Drive Families
Toshiba Develops First 16-die Stacked NAND Flash Memory with TSV Technology

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .