Sunday, August 30, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Alienware Brings Liquid Cooling and Dynamic Overclocking to Holiday Lineup
Razer Launches Wildcat Xbox One Controller And Upgraded Nabu Smartband
Workstation Market Shippments Rebound In Q2
Google Will Help You Find Your Plumber
IFA 2015: What We Know So Far
Acer Liquid Z410 And Liquid Jade Z Phones Released
Huawei Honor Phones Coming To Europe
AMD Radeon R9 370X Graphics Card Launched In Asia
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, October 31, 2013
Toshiba Launches New 19nm Embedded NAND Flash Memory Modules


Toshiba launches a new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

Toshiba's new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's 19nm second generation process technology and a dedicated controller into a small package measuring 11.5 x 13 x 1.0mm. It is compliant with JEDEC e・MMCTM Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.

The JEDEC e•MMCTM V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software.

Toshiba will bring the NAND chips to a line-up of single-package embedded NAND flash memories in densities from 4GB to 128GB. All will integrate a controller to manage basic control functions for NAND applications.

Product Name

THGBMBG8D4KBAIR

THGBMBG7D2KBAIL

Interface

JEDEC e•MMCV5.0 standard

HS-MMC interface

Capacity

32GB

16GB

Power Supply Voltage

2.7~3.6V  (Memory core)

1.7V~1.95V / 2.7V~3.6V  (Interface)

Bus Width

x1 / x4 / x8

Write Speed

90MB per sec.(Sequential/HS400 Mode)

50MB per sec.(Sequential/HS400 Mode)

Read Speed

270MB per sec.(Sequential/HS400 Mode)

270MB per sec.(Sequential/HS400 Mode)

Temperature Range

-25degrees to +85degees Celsius

Package

153Ball FBGA

11.5x13x1.0mm

153Ball FBGA

11.5x13x0.8mm





Previous
Next
HTC to Appeal U.K. Patent Ruling        All News        Mobile Ads Push Facebook's Revenue
VIA Launches Springboard Platform For Android and Linux Devices     PC Parts News      Intel To Make Altera's First 64-bit ARM Chip

Get RSS feed Easy Print E-Mail this Message

Related News
Toshiba Launches Wireless Power Receiver IC for Quick Charging Mobile Devices
Samsung Rolls Out Line-up of V-NAND SSDs For Data Centers
Samsung Begins Mass Producing 256-Gigabit, 3D V-NAND Flash Memory
Toshiba Unveils Three NVME Solid State Drive Families
Toshiba Develops First 16-die Stacked NAND Flash Memory with TSV Technology
Toshiba Announces Third Generation of Enterprise SAS SSDs, Starts Production Of 3D NAND
Toshiba Expands Line-up of ARM Cortex -M-based Microcontrollers
Toshiba CEO Resigns Following Accounting Scandal
Toshiba Inflated Profits
Toshiba Moves To New Process Technologies for Microcontrollers and Wireless Communication ICs
Toshiba Demonstrates New Technology For 3D Hard Disks
Toshiba Announces 6TB Enterprise Cloud HDD

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .