Saturday, October 01, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Nintendo NES Classic Edition Launches In Novemer, NX Could be Announced Earlier
Foxconn's Sharp to Invest $570 Million on Flexible OLED Panel Production
Google Apps for Work Become Smarter, Part Of New G Suite
Amazon Offers $2.5 Million to Advance Conversational Artificial Intelligence
Raspberry Pi Upgraded With A Visual Overhaul Called Pixel
E FUN Nextbook Ares 11 2-in-1 Android Tablet Costs Just $179
Micron Opens Fab 10 Singapore NAND Flash Memory Fabrication Facility
Qualcomm in Talks to Buy NXP
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Altera ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, March 26, 2014
Altera and Intel To Make Multi-Die Devices


Altera and Intel will collaborate on the development of multi-die devices that leverage Intel's package and assembly capabilities and Altera's programmable logic technology.

The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera's work with Intel will enable the development of multi-die devices that integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics.

Intel's 14 nm Tri-Gate process density advantage and Altera's patented FPGA redundancy technology enable Altera to deliver the industry's highest density monolithic FPGA die, offering greater integration of system components on a single die. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.

"Our partnership with Altera to manufacture next-generation FPGAs and SoCs using our 14 nm Tri-Gate process is going exceptionally well," said Sunit Rikhi, vice president and general manager, Intel Custom Foundry. "Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging. Together, both companies are building off one another's expertise with the primary focus on building industry-disrupting products."




Previous
Next
Cisco Makes Gigabit Wi-Fi More Affordable        All News        AMD To Release New FirePro W9100 Graphics Card Soon
Cisco Makes Gigabit Wi-Fi More Affordable     PC Parts News      Connected Data Reveals Gen 3 Drobo Disk Subsystem

Get RSS feed Easy Print E-Mail this Message

Related News
Microsoft Creation New Artificial Intelligence and Research Group
Amazon, Google, Facebook, Microsoft And IBM Establish Partnership on AI Best Practices
NVIDIA Launches New AI Technology At Third Regional GPU Tech Conference
Samsung Narrows Gap With Intel In Semiconductor Industry Ranking
Intel Raises Third-Quarter Revenue Expectations
TPG to Buy Intel's McAfee Security Unit
Intel to Buy Movidius To Accelerate Computer Vision Through RealSense
Intel 7th Generation Kaby Lake Processors Released
Intel Introduces New 3D NAND SSDs
Intel to Accelerate Altera, Autonomous Driving
Nvidia Says Intel Is Misleading With Outdated Deep Learning Benchmarks
Intel Says USB-C Audio Could Kill Traditional Headphone Jacks

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .