Wednesday, February 22, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Europe Probes Windows 10 Data Collecting Features
Google Dominates VR Headset Shipments But Samsung Gets The VR Revenues
Intel Announces 5G Mobile Trial Platform, New Atom And Xeon Processors
Verizon and Yahoo Agree to Lowered $4.48 billion Deal
New Snapdragon X20 LTE Modem Is Paving the Way for 5G
TrendForce Sees Three New iPhones Coming This Year, Including AMOLED Model With 3D Facial Recognition Function
New LG X400 Smartphone Launches In Korea
Samsung to Exhibit New VR Projects at Mobile World Congress 2017
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, July 31, 2014
Toshiba, Samsung Vie For 48-layer 3-D NAND Chips


Two of the world's major NAND flash memory chip makers -- Toshiba and Samsung Electronics -- are competing against each another on the development and commercialization of next-generation 3-D memory chips.

NAND flash memory chips are used in smartphones and PCs.

While conventional memory chips basically consist of one layer of memory elements, 3-D chips are made by stacking up dozens of thin layers of memory elements. This multiple-layer method helps expand memory capacity dramatically. Toshiba is aiming to produce NAND memory chips capable of storing 1 terabyte of data by fiscal 2019.

The more layers 3-D memory chips have, the larger their memory storage capacity will become. Both companies have yet to disclose their developmental status, but unconfirmed reports claim that they have achieved 24 layers last year and are expecting to develop 32-layered memory chips this year.

Thought 3D chips are still in the developmental stage, industry experts point out that conventional two-dimensional memory chips still offer more advantages at present. Observers say that both Toshiba and Samsung are looking to achieve 48 layers in 2015 and are now rushing to turn out truly next-generational memory products ahead of their main competitor.



Previous
Next
AMD Introduces New Kaveri APUs for System Builders        All News        Sony Reports First Quarter Profit
Lite-On IT Merged With Lite-On     General Computing News      Sony Reports First Quarter Profit

Get RSS feed Easy Print E-Mail this Message

Related News
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6
A Closer Look At SK Hynix's 3D NAND
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Samsung to Start Making 64-layer 3-D Flash memory for Smartphones
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Western Digital Announces First 64 Layer 3D NAND Technology
Toshiba To Produce First 64-layer 3D NAND Flash Memory Chip
China To Invest In 3D NAND Flash Plant
3D NAND-Flash Memory Makers Invest n New Facilities
SK Hynix Starts Mass Production Of 3D NAND Memory
Micron Outlines Tts First 3D NAND Products

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .