Sunday, February 19, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Samsung Galaxy Tab S Series To Include Windows Version
Researchers Introduce New Wireless Charging Technology
HTC Takes VR lead in China
SoftBank To Offload Sprint: report
New Mac OS X Malware Steal Passwords, And iPhone Backups
Xiaomi Launches a Smart GPS-Watch and A Smart Guitar
Alphabet Advances Its 'Loon' Baloon Internet Plan
Samsung Chief Arrested
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > SK Hyni...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, October 16, 2015
SK Hynix To Produce V-NAND In 2016


South Korean chipmaker SK Hynix will begin the mass production of 48-layered three-dimensional (3D) vertical NAND (V-NAND) flash memories next year, according to its chief executive.

"After completing the development of 36-layered 3D NAND flash memory chips this year, we will develop 48-layered 3D NAND flash memories next year and begin mass producing them,”"said SK Hynix CEO Park Sung-wook on Wednesday.

SK Hynix will be the industry’s second semiconductor manufacturer to mass produce 48-layered 3D NAND flash memory following Samsung Electronics Co., which began mass producing the high-performance memory chip in August.

3D NAND stacks memory cells vertically, and therefore, boasts faster speed and enhanced durability. It also reduces energy consumption and is less volatile.

Toshiba and Micron Technology are also on their way to mass produce 3D NAND flash memories.



Previous
Next
Video Game Holiday Expectations        All News        Microsoft To Pay You Trade Up Your Old Computer
Intel-Powered Arduino 101 Board Coming Next Year     PC Parts News      Microsoft To Pay You Trade Up Your Old Computer

Get RSS feed Easy Print E-Mail this Message

Related News
Micron's 2017 Roadmap Includes 64-layer 3D NAND And GDDR6
SK Hynix Launches First 8GB LPDDR4X For Mobile Devices
A Closer Look At SK Hynix's 3D NAND
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
Samsung to Start Making 64-layer 3-D Flash memory for Smartphones
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Western Digital Announces First 64 Layer 3D NAND Technology
Toshiba To Produce First 64-layer 3D NAND Flash Memory Chip
SK Hynix to Promote Its MDS Technology
SK Hynix To Reduce Investments In Memory Chips
China To Invest In 3D NAND Flash Plant

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .