Thursday, March 30, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
SpaceX To Launch First Reused Rocket
A Look At Samsung S8's Biometric Technologies
Semiconductor Market Showed Recovery Signs In 2016
Toshiba Investors Approve Memory Chip Sale
Micron's 1xnm DRAM Process Has Low Yields, Says Report
Windows 10 Creators Update Coming April 11
Samsung Galaxy S8 and S8+ Are Official, Along With Bixby And New Gear 360
Razer Blade Pro IS The First THX Certified Gaming Laptop
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, February 07, 2017
Rambus Introduces 14nm High Bandwidth Memory PHY For Data Centers


Rambus is making available its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES FX-14TM ASIC Platform.



Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory. This PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, enabling a total bandwidth of 256 GB/s.

The Rambus HBM PHY delivers high performance with lower power consumption when compared to other memory solutions. It combines 2.5D packaging with a wider interface (1024 bits) at a lower clock speed, which results in a higher overall throughput while remaining energy efficient for even the most high-performance computing applications. Rambus experts perform complete signal and power integrity analysis on the entire 2.5D systems to ensure all signal and thermal requirements are met.



Previous
Next
HGST Introduces The Skyhawk NVMe-compliant PCIe SSDs        All News        YouTube Takes On Facebook With Mobile Live Streaming
HGST Introduces The Skyhawk NVMe-compliant PCIe SSDs     PC Parts News      Lenovo Announces New Low Temperature Solder PC Manufacturing Process

Get RSS feed Easy Print E-Mail this Message

Related News
Rambus Launches CryptoMedia Platform to Secure Premium Digital Entertainment
Rambus And Microsoft To Explore Future Memory Systems
Rambus Joins MPEG LA’s DisplayPort Patent Pool
Rambus To Start Selling Own Server Chips
Rambus and SK Hynix Extend Their License Agreement
Rambus Develops R+ DDR4/3 PHY on Samsung 28nm LPP Process
Rambus Signs License Agreement with Qualcomm
Rambus and Nanya Sign Patent License Agreement
Rambus CMOS Sensor Fits In Cameras Without Lens
Rambus Signs Agreement with Samsung
Rambus Settles Patent Disputes With Micron
Rambus Signs Agreement with STMicroelectronics

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .