Wednesday, September 26, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google to Allow Chrome users to Disable Automatic Login Feature
Multimedia-focused Nero 2019 Released
Mouse and Keyboard Support for Xbox One Coming Soon
Apple Said to Shaves Cost from Displays in iPhones
GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform, Enhanced 14/12nm FinFET offerings
Qualcomm Says Apple Gave Modem Secrets to Intel
Firefox Monitor Will Help You Take Control After a Data Breach
Intel Adds to Portfolio of FPGA Programmable Acceleration Cards
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > ASML De...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, July 14, 2017
ASML Demonstrates a 250-watt EUV Source


Semiconductor industry finally appears close to moving extreme ultraviolet (EUV) lithography into high volume production, as lithography vendor ASML demonstrated a 250-watt EUV source.

Source power is a measurement of the amount of EUV photons delivered to the scanner to enable wafer exposure and equates directly to productivity. Chipmakers have said that a source power of 250 watts would be required to achieve throughput of 125 wafers per hour (WPH).

At the Semicon West tradeshow in San Fransisco earlier this week, ASML demonstrated a 250-watt EUV source.

Michael Lercel, director of strategic marketing at ASML, said the company has demonstrated 250 watts "rather consistently by really understanding the conversion efficiency in the source and putting the right controls in place." He said the source that has demonstrated 250 watts has not yet shipped.

Intel, Samsung, TSMC and Globalfoundries are planning to insert EUV into high-volume production sometime in the next two years.

The semiconductor industry was originally hoping to use EUV in production early this decade, but development has slipped continually.

ASML claims that although the cost of the EUV chip making device is higher than $100 million each, EUV offers an economic benefit compared to the expensive of triple- or quadruple-patterning using immersion lithography tools.



Previous
Next
ZTE Blade Spark Smartphone Costs Less Than $100        All News        Facebook May Release a $200 Wireless Oculus VR Headset Next Year
Toshiba to Delay Chip Unit Deal Until July 28     General Computing News      Facebook May Release a $200 Wireless Oculus VR Headset Next Year

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Details its 7nm EUV Technology
Samsung Starts Researching EUV For DRAM: report
Samsung Details Foundry Plans, 3nm Gate-All-Around FETs Coming in 2021
Chinese Chipmaker SMIC Orders $120m EUV System
Questions Remain on TSMC's 7nm, 5nm Gains
ASML's Solid Q1 Results Demonstrate Further Adoption of EUV Technology
Imec and Cadence Tape Out First 3nm Chip
SPIE: ASML Demos NXE 3400B Production of 140 Wafers per Hour
IMEC Researchers Optimistic About Dealing With EUV Defects in 5nm Node
IBM Researchers Talk About the Future of EUV at SPIE
Samsung Breaks Ground on New EUV Line in Hwaseong
Samsung and Qualcomm Expand Foundry Cooperation on EUV Process Technology

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .