Wednesday, September 19, 2018
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Youtube Launches New Gaming Section
U.S. Justice Department Probes Elon Musk Over Statement on Taking Tesla Private
Microsoft Announces With New AI, HoloLens Features
Nintendo Switch Fortnite Double Helix Bundle Launches Next Month
Samsung's New Odyssey Z Gaming Laptop Retails for $1,800
Apple Paid 13.1 billion Euro Taxes to Ireland Ahead of Appeal
Firefox Reality VR Browser Now available for Viveport, Oculus, and Daydream
VIZIO's New 2018 Home Theater Sound Systems With Dolby Atmos is Starting at $499.99
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > General Computing > Chinese...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, May 15, 2018
Chinese Chipmaker SMIC Orders $120m EUV System


Semiconductor Manufacturing International Co. (SMIC), China's top state-backed contract chipmaker, has reportedly ordered a set of extreme-ultraviolet lithography equipment from Dutch ASML.



SMIC's reserved EUV system is expected to be delivered by early 2019, according to Nikkei Asian Review.

The move highlights its growing ambition to help boost Chinese homegrown semiconductor manufacturing technology, even though it is still two to three generations behind market leaders.

All top global chip giants, including Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. are buying EUV equipment to ensure the later production of more advanced chips.

TSMC, the world's biggest contract chipmaker by revenue, for instance, has booked up to 10 systems for this year. Samsung has booked roughly six EUV systems, while Intel will take about three for 2018, according to sources quoted by Nikkei. GlobalFoundries, the world's No. 2 contract chipmaker, also placed an order for one.

The order by SMIC in April came after the U.S. said it will ban Chinese telecommunications equipment maker ZTE from using American-made components and services for seven years.

The U.S. and China are currently negotiating trade issues. U.S.

SMIC counts Qualcomm, Huawei's chip arm Hisilicon Technologies, and other chip designers as clients.

But the company is roughly two to three generations behind TSMC, Samsung and Intel in terms of manufacturing technology. It is still working to improve its own 28-nanometer process technology and last year brought in Liang Mong-song, a former senior executive at Samsung and TSMC, to be its co-chief executive to help develop its 14-nanometer process technology. Samsung and TSMC are now racing to manufacture 7-nanometer chips.

The EUV system works by projecting the light through a blueprint. Using a series of complex optics, made by German company Zeiss, the pattern is reduced and focused onto a thin slice of silicon coated with a light-sensitive chemical. The light interacts with the chemical effectively printing the pattern onto the silicon or wafer. When the unwanted silicon is etched away a three-dimensional structure is created. This is repeated dozens of times, layer upon layer, leaving a grid of hundreds of chips on one silicon wafer.

The light has to be focused in a vacuum to stop it being absorbed by air -- a difficult technological feat -- and the parameters are so small that the machine is working to within the size of an atom.

The tiniest speck of dust infiltrating the machine could ruin the design, leaving blank spaces on the chips.



Previous
Next
Samsung in Talks with ZTE to Offer Exynos Mobile Processor        All News        Kaspersky Lab Moving Core Infrastructure to Switzerland
Foxconn's Q1 Profit Declined     General Computing News      Kaspersky Lab Moving Core Infrastructure to Switzerland

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Details its 7nm EUV Technology
Samsung Starts Researching EUV For DRAM: report
Samsung Details Foundry Plans, 3nm Gate-All-Around FETs Coming in 2021
ASML's Solid Q1 Results Demonstrate Further Adoption of EUV Technology
Imec and Cadence Tape Out First 3nm Chip
IMEC Researchers Optimistic About Dealing With EUV Defects in 5nm Node
IBM Researchers Talk About the Future of EUV at SPIE
Samsung Breaks Ground on New EUV Line in Hwaseong
Samsung and Qualcomm Expand Foundry Cooperation on EUV Process Technology
Chinese SMIC to Start 7nm R&D This Year
ASML Buys Stake In Carl Zeiss To Advance EUV Lithography Efforts
ASML Makes Progress on EUV

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2018 - All rights reserved -
Privacy policy - Contact Us .