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Wednesday, March 21, 2018

At the OCP summit this week Seagate said its new MACH.2 Multi Actuator technology has enabled them to set a new hard drive speed record, and also demonstrated the reliability of its HAMR (Heat-Assisted Magnetic Recording) technology hard drives.

Tuesday, March 20, 2018

Intel today announced the Twin Lakes 1S server, which incorporates the energy-efficient capabilities of the Intel Xeon D-2100 Processor SoC to provide strong compute performance as well as high I/O density.

AMD has released the first update regarding the security vulnerabilities involving some AMD products reported by CTS Labs, and the first updates are coming in the following weeks.

At the Open Compute Project (OCP) U.S. Summit 2018 in San Jose, Microsoft announced today a next generation specification for solid state device (SSD) storage, Project Denali.

Marvell today announced that it is launching NVM Express (NVMe)-based chipset solutions designed to power data center SSD implementations.

LITE-ON Storage will demonstrate its latest enterprise drives, the NVRAM Hybrid SSD, during the OCP U.S. Summit 2018, kicking off today.

Seagate Technology today unveiled its 14TB helium-based Exos X14 enterprise drive at the OCP U.S. Summit 2018 in San Jose, Calif. The new hard disk delivers high performance and greater capacity for hyperscale data centers.

Samsung has made available in the U.S. the Galaxy Tab Active2, a rugged tablet designed for mobile workers.

Today at the 2018 Open Compute Project (OCP) U.S. Summit, Toshiba announced the general availability of KumoScale, its new NVMe-oF (NVM Express over Fabrics) shared accelerated storage software.

At IBM THINK in Las Vegas, IBM reported a breakthrough in AI performance using new software and algorithms on optimized hardware, including POWER9 with NVIDIA V100 GPUs.

Samsung Electronics is rolling out ithe PM883, an 8TB datacenter SSD, which uses LPDDR4 DRAM modules and features a 6.0-gigabits-per-second (Gbps) 2.5-inch SATA interface.

Monday, March 19, 2018

Nimbus Data today announced the ExaDrive DC100, the largest capacity (100 terabytes) solid state drive (SSD) ever produced.

Claiming performance advantages over CPUs and GPUs for applications related to Big Data and artificial intelligence, Xilinx will begin rolling out a new type of multicore chip next year that emphasize compute capability and with both software- and hardware-level programmability.

Rambus is collaborating with IBM to research hybrid memory systems and will develop a flexible prototype hybrid memory platform using the OpenCAPI interface to demonstrate performance of multiple memory types in real-world server applications.

Toshiba has enhanced its portfolio of solid-state drives (SSDs) for the data center with a new, 3D flash memory-based lineup of PCI Express NVMe and SATA SSDs in multiple form factors.

HyperX, the gaming division of Kingston Technology, is adding higher frequency memory modules to the HyperX FURY DDR4 DIMM and HyperX Impact DDR4 SODIMM product lines.

Thursday, March 15, 2018

Intel is working at the hardware level to protect against Spectre and Meltdown security vulnerabilities, with security fixes baked directly into the processor, ready for the next round of Xeon Scalable processors code named 'Cascade Lake', as well as 8th Generation Intel Core processors set to ship in the second half of 2018.

Logitech is lighting up its family of gaming gear with the introduction of the Logitech G560 PC Gaming Speaker and the Logitech G513 Mechanical Gaming Keyboard.

Wednesday, March 14, 2018

Samsung Electronics will expand the capacity of NAND flash memory production in its complex in Xian, China, to ensure its leading position in the market for chips powering mobile, IoT devices, and big data solutions.

Raspberry Pi 3 has received a "plus" treatment, coming with a faster CPU, Wi-Fi and Ethernet, and it is already available for $35.

Tuesday, March 13, 2018

Microsoft is expanding the devices covered by Windows security updates by removing the anti-virus compatibility check for Windows 10 devices, expands the availability of Intel microcode updates in the Microsoft Catalog, and adds coverage for x86 editions of Windows 7 and Windows 8.1.

Last year Google brought the Google Assistant to iPhones and today, iPads are joining the party.

Advanced Micro Devices (AMD) is investigating a report that processors from its AMD Ryzen & EPYC product lines have 13 "critical" security vulnerabilities and manufacturer backdoors.

Companies are showcasing 400 Gbit/second Ethernet optical modules for to data centers at this week's Optical Fiber Conference (OFC), with actual deployments to be expected not earlier than the end of 2019.

Monday, March 12, 2018

For 1Q18, the average contract prices of mainstream Client SSD for PC OEMs are estimated drop by 3-5% in SATA-SSD sector and 4-6% in PCIe-SSD sector compared with the previous quarter.

Friday, March 09, 2018

Intel has made available microcode updates for the Ivy Bridge and Sandy Bridge processor families, designed to address Spectre and Meltdown vulnerabilities.

Western Digital plans to invest about 500 billion yen ($4.68 billion) over the next three years in a memory-chip joint venture with Toshiba, following a six-month court battle between the two memory partners companies.

Thursday, March 08, 2018

Today, Intel announced the Intel Optane SSD 800P, the latest addition to the Intel Optane technology family of products designed to speed up slower storage, like hard disk drives and SATA SSDs.

Starting with the next update to Windows 10, you will be able to choose to buy a new Windows 10 Home or Windows 10 Pro PC with S mode enabled.

Wednesday, March 07, 2018

Today during Windows Developer Day, Microsoft announced Windows ML, which enables developers to perform machine learning tasks in the Windows OS.

The new Verbatim ToughMAX USB 2.0 Drive has been made with KyronMAX compounds, a metal replacement thermoplastic material which is able to withstand punishing conditions.

Tuesday, March 06, 2018

Shesha Krishnapura, Intel Fellow and IT chief technical officer, has found a novel way to save money and reduce waste by creating a modular server design that allows critical components to be upgraded easily.

Friday, March 02, 2018

Depite the advantages of gaming on a Windows 10 system, it look like gamers - at least in specific regions - are still playing games on their Windows 7 PCs.

Thursday, March 01, 2018

Microsoft has made available Intel microcode updates (firmware), initially for some Skylake devices running the most broadly installed version of Windows 10 - the Windows 10 Fall Creators Update - through the Microsoft Update Catalog, KB4090007.

HPE and Dell are tied for the No. 1 spot in server sales, IDC reports, with market shares of 18.4 percent and 17.5 percent respectively.

China's government reportedly plans to raise as much as 200 billion yuan ($31.5 billion) to invest in homegrown chip companies and eventually build a competitive semiconductor industry.

Micron and Intel have announced that they will part ways after finishing the development of 96-layer 3D-NAND flash, and Intel will reportedly seek for new partnerships in China.

Wednesday, February 28, 2018

Global shipments of personal computing devices (PCDs) - composed of traditional PCs (desktop, notebooks and workstations) and tablets (slate and detachable) - declined 2.7% year over year in 2017.

Tuesday, February 27, 2018

Silicon Motion today introduced its new FerriSSD single-chip SSDs that features PCIe Gen 3 NVMe 1.3 interface for mission critical applications.

Wacom has made available the Wacom Cintiq Pro 24 pen display, expanding the Cintiq Pro high-definition range, which is designed for creative professionals.

Toshiba today announced its new 2.5-inch MQ04 Series 2TB HDD model MQ04ABD200, designed for use in notebook PCs, all-in-one and slim-line desktop systems.

Monday, February 26, 2018

At Mobile World Congress, Western Digital is releasing the ulra-fast UHS-I flash memory card, the 400GB SanDisk Extreme UHS-I microSDXC card, demonstrates Peripheral Component Interconnect Express (PCIe)-enabled cards, and two new NVMe SSDs - Western Digital PC SN720 and Western Digital PC SN520.

At MWC this year, Lenovo is introducing the new Yoga 730 (in 13-inch and 15-inch models) and the new 14-inch Yoga 530 2-in-1 family. The company has also on display a trio of Chromebooks for education, the Lenovo 100e, 300e and 500e.

Sunday, February 25, 2018

Huawei today unveiled the HUAWEI MateBook X Pro, the HUAWEI MediaPad M5 Series and the HUAWEI 5G customer-premises equipment (CPE), the first commercial terminal device supporting the globally recognized 3GPP telecommunications standard for 5G.

Thursday, February 22, 2018

CORSAIR today unveiled a new identity for its Obsidian Series of enthusiast PC cases with the launch of the CORSAIR Obsidian Series 500D.

Intel will showcase a prototype of a 2-in-1 PC featuring a 5G cellular modem at Mobile World Congress, and announced a 5G SoC design collaboration with China's Spreadtrum.

Wednesday, February 21, 2018

Fujitsu introduces its latest flagship 2 in 1 detachable device - the Fujitsu Tablet STYLISTIC Q738.

AMD today introduced two new product families - the AMD EPYC Embedded 3000 processor and AMD Ryzen Embedded V1000 processor - bulit on AMD's 14nm FinFET process.

Intel has released production microcode updates to its OEM customers and partners for Kaby Lake- and Coffee Lake-based platforms, plus additional Skylake-based platforms, as part of the Spectre and Meltdown security patches.

Tuesday, February 20, 2018

Samsung has begun mass producing the industry's largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) - the PM1643 - for use in enterprise storage systems.

Monday, February 19, 2018

Microsoft published a full list of limitations of Windows 10 running on new ARM-powered Windows 10 PCs, which are coming from HP, Asus, and Lenovo.

Friday, February 16, 2018

Intel on Friday unveiled that 32 class action lawsuits had been filed against the company in connection with the recently disclosed Meltdown and Spectre security flaws in its processors.

Thursday, February 15, 2018

Intel has officially unveiled the Intel SSD DC P4510 and P4511 Series of SSDs for data center applications. They are using 64-layer TLC Intel 3D NAND, with the P4511 Series to come in the space-saving Enterprise and Datacenter SSD Form Factor (EDSFF).

HP Inc. today unveiled a new set of Device as a Service (DaaS) offerings for its customers and channel partners, including the launch of DaaS for Apple.

Samsung's new Notebook 9 Pen, Notebook 9 (2018) and Notebook 7 Spin (2018) will be available for purchase starting February 18.

Wednesday, February 14, 2018

Intel is introducing a new feature with the ability to automatically configure game settings for Intel Graphics on 6th Gen Core Processors or higher.

Intel is expanding its bug bounty program to focus on side channel vulnerabilities and also increases the awards for disclosures made by security researchers.

Intel and Samsung presented papers at the International Solid-State Circuits Conference (ISSCC) describing their work on 10-nm SRAM and 7-nm SRAm, respectively, with Samsung's 256-Mbit SRAM to be made with extreme ultraviolet lithography.

Tuesday, February 13, 2018

The Gen-Z Consortium, an organization developing an open standard interconnect designed to provide high-speed, low latency, memory-semantic access to data and devices, released the Gen-Z Core Specification 1.0.

Monday, February 12, 2018

Intel is expanding the performance options available for mainstream laptops and 2 in 1s with the 8th Gen Intel Core i3 processor.

AMD has officially released the new quad-core Ryzen 5 2400G and Ryzen 3 2200G desktop processors, which combine high-performance Radeon "Vega" architecture with "Zen" CPU Cores on a single chip.

American laptop brands show strong momentum, with Apple and HP to record double-digit growth in 2017.

Thursday, February 08, 2018

Intel has issued a new microcode update for mobile Skylake and mainstream desktop Skylake processors that gives operating systems the ability to protect against the Spectre flaw revealed earlier this year.

Wednesday, February 07, 2018

Intel today introduced the new Intel Xeon D-2100 processor, a system-on-chip (SoC) processor aimed at lower-power, high-density edge solutions, integrating essential network, security and acceleration capabilities.

Panasonic's newest version of its fully rugged detachable notebook, the Toughbook CF-20, brings to mobile business more computing performance, security and usability.

HP today unveiled a range of new devices, displays and accessories designed for the workforce, including the rollout of several features to the HP EliteBook 800 series and HP ZBook 14u/15u mobile workstations.

Tuesday, February 06, 2018

AMD's EPYC 7000 series processors are powering three of the newest Dell EMC PowerEdge platforms - the PowerEdge R6415, R7415, and R7425.

In cooperation with the U.S. Consumer Product Safety Commission (CPSC), Lenovo is recalling selected ThinkPad X1 Carbon 5th Generation laptops manufactured between December 2016 and October 2017.

Monday, February 05, 2018

LG Electronics has made available in the U.S. its latest high-performance LG gram notebooks, which first appeared earlier this month at CES 2018.

The detachable tablet market grew to 6.5 million units in the fourth quarter of 2017 (4Q17), an increase of 10.3% from the previous holiday season, with Apple to maintain its leadership.

At SOLIDWORKS World, HP announced it will power its HP Z4 workstation with a choice of Intel Xeon or Core X processors and support dual graphics. The company showcased the HP Windows Mixed Reality Headset - Professional Edition.

Sunday, February 04, 2018

SK Hynix Inc. recently completed developing a 4TB enterprise SATA Solid State Drive ('eSSD'), featuring 72-Layer 512Gb (Gigabits) 3D NAND Flash chips.

Thursday, February 01, 2018

Plextor has released the M8V series, which includes budget-friendly SATA SSDs based on 64-layer 3D TLC NAND.

Tuesday, January 30, 2018

Sales in AMD's computing and graphics segment boosted the company's revenue in the fourth quarter, but the company is more cautious for the current quarter results.

Samsung Electronics has launched an 800GB solid state storage drive, the SZ985 Z-SSD, designed for advanced enterprise applications including supercomputing for AI analysis.

Thursday, January 25, 2018

Verbatim has launched the Vx500 External SSD with high speed flash memory and a USB 3.1 Gen 2 controller.

Fujitsu announced its next generation of ETERNUS AF S2 all-flash storage arrays and ETERNUS DX S4 midrange hybrid systems.

At Bett, Google announced a diverse lineup of 2018 Chromebooks including two next generation Chromebooks: the Lenovo 500e Chromebook and Dell Chromebook 11 2-in-1 5190.

Tuesday, January 23, 2018

Intel is introducing a new line of 7-Series SSDs starting with the 760p model. Designed for consumers, the 760p SSD offers 2x the speed with half the power use, according to Intel.

Samsung Electronic today introduced the 860 PRO and 860 EVO solid state drives (SSDs), the most up-to-date additions to the company's SATA interface lineup.

Micron Technology today launched the Micron 5200 series of SATA solid state drives (SSDs), maintaining performance, consistency, capacity and overall infrastructure value.

Acer announced at the Bett show in London new devices designed for the education - the new Chromebook 11, the Acer Chromebook Spin 11 and the Acer Chromebox CX13.

Monday, January 22, 2018

Intel has asked computer makers to stop rolling out a set of faulty patches it issued to fix security flaws in its chips and instead start testing an updated version.

This week at Microsoft will show new Windows 10 and Windows 10 S devices from Lenovo and JP, starting at just $189, providing more options for schools and alternatives to Chromebooks.

The U.S. International Trade Commission (USITC) is inverstigating solid state storage drive made by Samsung Electronics Co., SK Hynix Inc. Lenovo, Asus and more, for alleged unfair import trade practices.

Thursday, January 18, 2018

Western Digital is expanding its portfolio for enterprise customers with a new, mid-range series of 4 terabyte (TB), 6TB and 8TB air-based hard drives.

Data center computers with Intel's newer chips might reboot more often than normal because of problems with the patches issued to fix the Spectre and Meltdown security flaws.

Wednesday, January 17, 2018

Micrsoft says its Surface Book 2 is coming to all current Surface markets in both 13" and 15" sizes, and pre-order for Surface Book 2 15" begins today in 17 markets.

Tuesday, January 16, 2018

Western Digital today introduced two new transportable solutions in its G-Technology G-SPEED Shuttle product family.

Fujitsu releases in the Japanese market three new enterprise tablet models, 14 models of notebooks and three new models of desktop PCs.

Monday, January 15, 2018

United Microelectronics Corp. (UMC) has filed a lawsuit against Micron Technology subsidiaries in China for patent infringements.

Friday, January 12, 2018

CES closes its gates for this year but let's have a quick look at some interesting gaming PCs by iBUYPOWER, MSI and ORIGIN.

Security researchers claim that a Security Issue in Intel's Active Management Technology (AMT), which is commonly found in most corporate laptops, allows an attacker to take complete control over a user's device in a matter of seconds.

SSDs used to look a lot like HDDs but this is about to change, with the release of the "Ruler" form factor for Intel SSDs, a new solid state drive form factor enabling up to 1PB of storage in a 1U server rack in the future.

Advanced Micro Devices (AND) said on Thursday its microprocessors are susceptible to both variants of the Spectre security flaw, Seperately, Intel said that some issued patches could cause computers to reboot more often than normal.

Worldwide PC shipments totaled 71.6 million units in the fourth quarter of 2017, a 2 percent decline from the fourth quarter of 2016, according to preliminary results by Gartner, Inc.

Thursday, January 11, 2018

Google's Pixelbook Chromebook has been already patched but some other Chromebooks are still vulnerable to the Meltdown bug.

Phison Electronics is displaying its latest flash controller technology at the Consumer Electronics Show 2018 (CES) in Las Vegas, Nevada.

Intel is working with the industry to develop and distribute software and firmware mitigations for the "Spectre" and "Meltdown" and has released initial assessments of performance impact to Intel systems.

All News...

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