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Samsung Electro-Mechanics (SEMCO) is reportedly developing fan-out panel-level packaging (FOPLP) technology for the production of application processors (AP) for use in wearable devices since 2018....
South Korean semiconductor package company NEPES has commercialized Fan-out panel-level packaging (FOPLP) technology, one of the more controversial topics being discussed in the advanced...
Samsung Electro-Mechanics plans to commercialize FoPLP (Fan-out Panel Level Package) semiconductor packaging technology in the first half of 2017.
FoPLP is a...
