A New Era of Chipmaking to Meet the World’s Demand for Compute
Intel CEO Pat Gelsinger details how advanced compute and packaging are needed to meet the world’s insatiable demand for compute and implement fully immersive digital...
GIGABYTE Leads and Reveals the First PCIe 5.0 SSD
GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen5 10000 SSD with 10GB/s...
Apple expands Self Service Repair to Mac notebooks
Apple announced Self Service Repair will be available tomorrow for MacBook Air and MacBook Pro notebooks with the M1 family of chips, providing repair manuals...
KIOXIA Introduces Industrial Grade BiCS FLASH 3D Flash Memory
KIOXIA Europe GmbH today announced that it is sampling new industrial-grade flash memory devices. This new lineup utilizes KIOXIA’s latest generation BiCS FLASH 3D flash...
Samsung Electronics Breaks Ground on New Semiconductor R&D Complex in Giheung, Korea
Samsung Electronics today broke ground for a new semiconductor research and development complex in Giheung, Korea, aiming to extend its leadership in state-of-the-art semiconductor technology....
SP Industrial’s BiSC5 Flash Cards for Surveillance Edge and Professional Cinema Storage
BiCS5 is the latest version of 3D TLC NAND technology, featuring 112 layers in a single NAND Flash chip. The higher storage density is achieved...
JEDEC announces Universal Flash Storage (UFS) 4.0 specs
JEDEC Solid State Technology Association announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard,...
MSI Introduces Mini-LED Panel into Prestige 16
MSI has updated its Prestige series lineup with new members, Prestige 16 and Prestige 16 EVO. Both in Urban Silver color and equipped with Intel®...
Samsung announces Galaxy Z Flip4, Galaxy Z Fold4 and Buds2 Pro
Samsung Electronics today announced the next generation of groundbreaking foldable smartphones: Galaxy Z Flip4 and Galaxy Z Fold4. Both devices feature customizable form factors, tailored...
Shuttle announces Xeon-compatible Mini-PC Barebone with 4x LAN and ECC RAM support
To satisfy more than just the requirements of typical desktop applications, with the XPC Barebone SW580R8 the Taiwanese Mini-PC pioneer Shuttle is for the first...
