Fujitsu has developed a carbon nanotube-based package of heatsinks for semiconductor chips. The company plans to use them in high-frequency, high power amplifiers for next-generation...

ATI introduced the Mobility Radeon X1600 graphics processor for notebooks, featuring ATI's Avivo technology and support for Microsoft's Shader Model 3.0 and DirectX 9c. Mobility...

Teac launches its new line of External 1.8-Inch Mobile USB 2.0 Hard Disk Drives in 20GB, 40GB and 60GB capacities. TEAC's 1.8-Inch Mobile Hard Disk...

The sample we received from Intel this time was the 650, running at 3.4GHz.

MSI launches the new K8NGM2 supporting the latest C51 Nvidia chipset. The board utilizes the latest nForce4 chipset supporting the GeForce 6150/6100 integrated graphics. It...

Corsair send us their latest pair of memory modules, designed and tested to work in Dual Channel mode, with a added size of 2048MB (1024MB per module). These memory modules come from the Corsair "Platinum Series" and use a large heat spreader that lies on the chipsets.

Samsung pleaded guilty Wednesday to a charge it participated in a price-fixing conspiracy that damaged competitors and increased computer prices. In accordance with an October...

VIA released for free download, a VIA PadLock Security Engine SDK, which allows integration of its security feature set included within the VIA C7 processor...

Intel's chipset sortage has firstly emerged last summer, when the company shifted the focus of its production efforts on higher-end desktop parts. Corresponding to the...

Newly expanded E300 fab targets 54,000 wafers per month, the largest semiconductor capacity in Japan. Elpida Memory and Hiroshima Elpida Memory, announced today the completion...