Change to "Dual-Channel DDR3 2000(O.C.)/ 1800(O.C.)/ 1600 MHz

The motherboard supports DDR3 memory that features data transfer rates of 2000(O.C.)/1800(O.C.)/1600/1333/1066/800MHz to meet the higher bandwidth requirements of the latest operation system, 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture doubles the bandwidth of your system memory to boost system performance, eliminating bottlenecks with peak bandwidths of up to 17 GB/s. Furthermore, the supply voltage for the memory is reduced from 1.8 V for DDR2 to just 1.5 V for DDR3. This voltage reduction limits the power consumption and heat generation of DDR3 which makes it an ideal memory solution.

Fusion Block System: H2O ready: Water-cooling ready for optimal heat dissipation.
The Fusion Block System is a more efficient thermal solution than competing followers with complicated looks. It is a hybrid thermal design that combines the ROG´s renouned heatpipe design with the additional ability to connect to a water cooling system.

By taking the entire integrated solution into design consideration , with a single connection, user can enjoy exceptional thermal improvement to north bridge, south bridge, and even VRM. We also provide a super optional thermal kit that is used on NB and MOS to improve in heat dissipation. The Fusion Block System is the most versatile, the most efficient, and the most advanced thermal system there is on a motherboard.