Intel is expected to add USB 3.1 and Wi-Fi functions to its motherboard chipsets, in a move that could have an impact in third-party chip makers such as Broadcom, Realtek Semiconductor and ASMedia Technology. The new chipset design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017, according to sources from Taiwan.

Intel declined to comment.

The decision is expected impact existing third-party Wi-Fi and USB 3.1 chip makers including Broadcom, which is a major supplier of notebook WLAN chips, Realtek Semiconductor, a major supplier of desktop WLAN chips and ASMedia Technology, which has a major share in the USB 3.1 market.

The standardization of USB 3.1 technology is expected to accelerate the development of USB 3.1-based devices and increase demand for related chips and 10G signal redrivers and retimers.

Specifically for ASMedia, the orders the company has received for AMD's high-speed transmission interface chipset could lower the impact from Intel's plan.