IBM has successfully developed a prototype of the semiconductor industry's smallest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technology. IBM's SOI...

Rambus today unveiled a set of innovations that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. The company hopes that...

Hynix, LG, Samsung and Silicon Image today announced the formation of an industry consortium that promotes Serial Port Memory Technology (SPMT) for broad market adoption...

Elpida Memory, Inc, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), has been selected as a strategic technology partner of Taiwan Memory Company...

The Taiwanese government plans to merge its indebted DRAM memory chip makers into a single company called Taiwan Memory Company (TMC) in the following months,...

Samsung has developed and validated what it says is the first DDR 2 DRAM chips produced with 40-nanometer process technology. This 1Gb DDR2 component (x8)...

Samsung announced today that it has made a significant advancement in the push for higher volume memory chips by developing the world's first four gigabit...

German chipmaker Qimonda filed for insolvency on Friday after last-ditch talks to secure a state-led rescue failed. Qimonda said it filed an application...

Elpida Memory today introduced the industry's first 1-Gigabit XDR DRAM based on a x32-bit configuration. The new XDR product features the industry's fastest ultra-high speed...

Hynix Semiconductor announced
Besides its various features, the new product also has function of Hynix's One Chip Solutions. It offers flexible options for both...